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89TSF553B Datasheet(PDF) 10 Page - Integrated Device Technology |
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89TSF553B Datasheet(HTML) 10 Page - Integrated Device Technology |
10 / 30 page 10 of 30 March 3, 2005 IDT 89TTM553 88889TTM553 Electrical Specifications 9TTM553 Electrical Specifications 9TTM553 Electrical Specifications 9TTM553 Electrical Specifications Some data are TBD and will be published as they become available. The specifications are subject to change without notice. A A A Absolute Maximum Ratings bsolute Maximum Ratings bsolute Maximum Ratings bsolute Maximum Ratings The absolute maximum ratings are the maximum conditions that the device can withstand without sustaining permanent damage. Exceeding any of these conditions could result in permanent damage to the device. Normal operation should not be expected at these conditions. In addition, expo- sure to absolute maximum rated conditions (or near absolute maximum rated conditions) for extended periods may affect device reliability. Operation of the device is not guaranteed at the absolute maximum ratings, but rather at the operating conditions outlined in “DC Characteristics” on page 11 and “AC Characteristics” on page 12. Operating Ranges Operating Ranges Operating Ranges Operating Ranges VDD33 — — — 3.3V I/O power for LVTTL I/Os N/C — — N/A Do not connect. GND — I N/A Ground Symbol Parameter Min Max Units Conditions TJMAX Junction temperature under bias — 105 °C TSTORAGE Storage temperature — 150 °C Storage temperature range –40 85 °C Long term storage TSOLDER Soldering temperature — 215 °C TREWORK Rework temperature — 204 °C Table 12 Absolute Maximum Ratings Symbol Parameter Min Typical Max Units Conditions TJ Operating junction temperature range 0 — 85 °C IV15 Input current for 1.5V power supply — 800 — mA IV18 Input current for 1.8V power supply — 1.16 — A IV33 Input current for 3.3V power supply — 60 — mA VDD15 1.5V HSTL supply 1.425 1.5 1.575 V ±5% VDD18 1.8V Core supply 1.71 1.8 1.89 V ±5% Table 13 Operating Ranges (Part 1 of 2) Signal Name I/O Type Dir. Freq. Remarks Table 11 PLL I/O (Part 2 of 2) |
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