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CY62137CV30/33 MoBL®
CY62137CV MoBL®
Document #: 38-05201 Rev. *G
Page 4 of 13
Electrical Characteristics Over the Operating Range (continued)
Parameter
Description
Test Conditions
CY62137CV33-55
CY62137CV-70
Unit
Min. Typ.[2]
Max.
Min. Typ.[2]
Max.
VOH
Output HIGH Voltage
IOH = -1.0 mA
VCC = 3.0V
2.4
2.4
V
VCC = 2.7V
2.4
V
VOL
Output LOW Voltage
IOL = 2.1 mA
VCC = 3.0V
0.4
0.4
V
VCC = 2.7V
0.4
V
VIH
Input HIGH Voltage
2.2
VCC + 0.3 2.2
VCC+ 0.3
V
VIL
Input LOW Voltage
-0.3
0.8
-0.3
0.8
V
IIX
Input Leakage Current
GND < VI < VCC
-1
+1
-1
+1
µA
IOZ
Output Leakage Current GND < VO < VCC, Output
Disabled
-1
+1
-1
+1
µA
ICC
VCC Operating
Supply Current
f = fMax = 1/tRC VCC = 3.6V
IOUT = 0 mA
CMOS Levels
7
15
5.5
12
mA
f = 1 MHz
1.5
3
1.5
3
ISB1
Automatic CE
Power-down
Current —CMOS Inputs
CE > VCC – 0.2V
VIN > VCC – 0.2V or VIN < 0.2V,
f = fMax (Address and Data Only),
f=0 (OE, WE, BHE, and BLE)
5
15
5
15
µA
ISB2
Automatic CE
Power-down
Current —CMOS Inputs
CE > VCC – 0.2V
VIN > VCC – 0.2V or
VIN < 0.2V, f = 0, VCC = 3.6V
LL
5
15
5
15
µA
SL
5
15
1
5
Capacitance[6]
Parameter
Description
Test Conditions
Max.
Unit
CIN
Input Capacitance
TA = 25°C, f = 1 MHz, VCC = VCC(typ.)
6
pF
COUT
Output Capacitance
8
pF
Thermal Resistance[6]
Parameter
Description
Test Conditions
FBGA
Unit
Θ
JA
Thermal Resistance
(Junction to Ambient)
Still Air, soldered on a 3 x 4.5 inch,
2-layer printed circuit board
55
°C/W
Θ
JC
Thermal Resistance
(Junction to Case)
16
°C/W
Note:
6. Tested initially and after any design or process changes that may affect these parameters.
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