CY62158EV30 MoBL®
Document #: 38-05578 Rev. *D
Page 11 of 11
Document History Page
Document Title: CY62158EV30 MoBL®, 8-Mbit (1024K x 8) Static RAM
Document Number: 38-05578
REV.
ECN NO.
Issue Date
Orig. of
Change
Description of Change
**
270329
See ECN
PCI
New Data Sheet
*A
291271
See ECN
SYT
Converted from Advance Information to Preliminary
Changed ICCDR from 4 to 4.5 µA
*B
444306
See ECN
NXR
Converted from Preliminary to Final.
Removed 35 ns speed bin
Removed “L” bin.
Removed 44 pin TSOP II package
Included 48 pin TSOP I package
Changed the ICC Typ value from 16 mA to 18 mA and ICC max value from 28
mA to 25 mA for test condition f = fax = 1/tRC.
Changed the ICC max value from 2.3 mA to 3 mA for test condition f = 1MHz.
Changed the ISB1 and ISB2 max value from 4.5 µA to 8 µA and Typ value from
0.9
µA to 2 µA respectively.
Updated Thermal Resistance table
Changed Test Load Capacitance from 50 pF to 30 pF.
Added Typ value for ICCDR .
Changed the ICCDR max value from 4.5 µA to 5 µA
Corrected tR in Data Retention Characteristics from 100 µs to tRC ns
Changed tLZOE from 3 to 5
Changed tLZCE from 6 to 10
Changed tHZCE from 22 to 18
Changed tPWE from 30 to 35
Changed tSD from 22 to 25
Changed tLZWE from 6 to 10
Updated the ordering Information and replaced the Package Name column with
Package Diagram.
*C
467052
See ECN
NXR
Included 44 pin TSOP II package in Product Offering.
Removed TSOP I package; Added reference to CY62157EV30 TSOP I
Updated the ordering Information table
*D
1015643
See ECN
VKN
Added footnote #8 related to ISB2 and ICCDR
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