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Document #: 001-07721 Rev. *B
Page 4 of 10
CY62168EV30 MoBL®
Thermal Resistance[9]
Parameter
Description
Test Conditions
BGA
Unit
ΘJA
Thermal Resistance
(Junction to Ambient)
Still Air, soldered on a 3 x 4.5 inch, two-layer printed circuit
board
55
°C/W
ΘJC
Thermal Resistance
(Junction to Case)
16
°C/W
AC Test Loads and Waveforms
Parameters
2.5V (2.2V to 2.7V)
3.0V (2.7V to 3.6V)
Unit
R1
16600
1103
Ω
R2
15400
1554
Ω
RTH
8000
645
Ω
VTH
1.2
1.75
V
Data Retention Characteristics
Over the Operating Range
Parameter
Description
Conditions
Min
Typ[3]
Max
Unit
VDR
VCC for Data Retention
1.5
3.6
V
ICCDR[8]
Data Retention Current
VCC = 1.5V
CE1 > VCC − 0.2V or CE2 < 0.2V
VIN > VCC − 0.2V or VIN < 0.2V
10
µA
tCDR[9]
Chip Deselect to Data
Retention Time
0ns
tR[10]
Operation Recovery Time
tRC
ns
Data Retention Waveform
VCC
VCC
OUTPUT
R2
30 pF
INCLUDING
JIG AND
SCOPE
GND
90%
10%
90%
10%
OUTPUT
VTH
Equivalent to:
THÉVENIN EQUIVALENT
ALL INPUT PULSES
RTH
R1
Fall time: 1 V/ns
Rise Time: 1 V/ns
VCC(min)
VCC(min)
tCDR
VDR > 1.5 V
DATA RETENTION MODE
tR
CE1
VCC
CE2
or
Note
10. Full Device AC operation requires linear VCC ramp from VDR to VCC(min) > 100 µs or stable at VCC(min) > 100 µs.
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