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FR1604G Datasheet(PDF) 1 Page - Taiwan Semiconductor Company, Ltd |
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FR1604G Datasheet(HTML) 1 Page - Taiwan Semiconductor Company, Ltd |
1 / 2 page Dimensions in inches and (millimeters) Version: A06 FR1601G - FR1607G 16.0 AMPS. Glass Passivated Fast Recovery Rectifiers TO-220AB Features Glass passivated chip junction. High efficiency, Low VF High current capability High reliability High surge current capability Low power loss Mechanical Data Cases: TO-220AB molded plastic Epoxy: UL 94V-0 rate flame retardant Terminals: Pure tin plated, Lead free. Leads solderable per MIL-STD-202, Method 208 guaranteed Polarity: As marked High temperature soldering guaranteed: 260 oC /10 seconds .16”,(4.06mm) from case. Mounting position: Any Weight: 2.24 grams Maximum Ratings and Electrical Characteristics Rating at 25 oC ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load. For capacitive load, derate current by 20% Type Number Symbol FR 1601G FR 1602G FR 1603G FR 1604G FR 1605G FR 1606G FR 1607G Units Maximum Recurrent Peak Reverse Voltage VRRM 50 100 200 400 600 800 1000 V Maximum RMS Voltage VRMS 35 70 140 280 420 560 700 V Maximum DC Blocking Voltage VDC 50 100 200 400 600 800 1000 V Maximum Average Forward Rectified Current See Fig. 1 I(AV) 16.0 A Peak Forward Surge Current, 8.3 ms Single Half Sine-wave Superimposed on Rated Load (JEDEC method ) IFSM 150 A Maximum Instantaneous Forward Voltage @ 8.0A VF 1.3 V Maximum DC Reverse Current @ TC=25 oC at Rated DC Blocking Voltage @ TC=125 oC IR 5.0 100 uA uA Maximum Reverse Recovery Time ( Note 1) Trr 150 250 500 nS Typical Junction Capacitance (Note 3) Cj 60 pF Typical Thermal resistance (Note 2) RθJC 3.0 oC/W Operating and Storage Temperature Range TJ ,TSTG -65 to +150 oC Notes: 1. Reverse Recovery Test Conditions: IF=0.5A, IR=1.0A, IRR=0.25A. 2. Thermal Resistance from Junction to Case Per Leg Mounted on Heatsink Size 2” x 3” x 0.25” Al-Plate.. 3. Measured at 1MHz and Applied Reverse Voltage of 4.0 Volts D.C. |
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