BS62LV4006

R0201-BS62LV4006

Revision

1.4

May.

2006

8

n ORDERING INFORMATION

Note:

BSI (Brilliance Semiconductor Inc.) assumes no responsibility for the application or use of any product or circuit described herein. BSI does

not authorize its products for use as critical components in any application in which the failure of the BSI product may be expected to result

in significant injury or death, including life-support systems and critical medical instruments.

n PACKAGE DIMENSIONS

PACKAGE

D: DICE

E: TSOP II

H: BGA-36-0608

P: PDIP

S: SOP

T: TSOP (8mm x 20mm)

ST: Small TSOP (8mm x 13.4mm)

BS62LV4006

X

X

Z

Y Y

GRADE

C: +0

I: -40

SPEED

55: 55ns

70: 70ns

PKG MATERIAL

-: Normal

G: Green, RoHS Compliant

P: Pb free, RoHS Compliant

BASE METAL

WITH PLATING

c

c1

SECTION

A-A

b1

b

SOP -32