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For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order On-line at www.hittite.com

Outline Drawing

Absolute Maximum Ratings

Collector Bias Voltage (Vcc)

+7 Volts

RF Input Power (RFin)(Vcc = +3.9 Vdc)

+10 dBm

Junction Temperature

150 °C

Continuous Pdiss (T = 85 °C)

(derate 5.21 mW/°C above 85 °C)

0.34 W

Thermal Resistance

(junction to lead)

191 °C/W

Storage Temperature

-65 to +150 °C

Operating Temperature

-40 to +85 °C

Part Number

Package Body Material

Lead Finish

MSL Rating

Package Marking

HMC311SC70

Low Stress Injection Molded Plastic

Sn/Pb Solder

MSL1

[1]

311

HMC311SC70E

RoHS-compliant Low Stress Injection Molded Plastic

100% matte Sn

MSL1

[2]

311

[1] Max peak reflow temperature of 235 °C

[2] Max peak reflow temperature of 260 °C

Package Information

ELECTROSTATIC SENSITIVE DEVICE

OBSERVE HANDLING PRECAUTIONS

InGaP HBT GAIN BLOCK

MMIC AMPLIFIER, DC - 8 GHz

v01.0807

NOTES:

1. PACKAGE BODY MATERIAL: LOW STRESS INJECTION MOLDED

PLASTIC SILICA AND SILICON IMPREGNATED.

2. LEAD MATERIAL: COPPER ALLOY

3. LEAD PLATING: Sn/Pb SOLDER

4. DIMENSIONS ARE IN INCHES [MILLIMETERS].

5. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE.

6. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE.

7. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND.