FTR-C1 Series

7

RoHS Compliance and Lead Free Relay Information

Reflow Solder condtion for SMT

3. Moisture Sensitivity

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Moisture Sensitivity Level standard is not applicable to electromechanical realys.

4. Tin Whisker

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SnAgCu and SnCuNi solder is known as low risk of tin whisker. No considerable length whisker was found

by our in-house test.

We highly recommend that you confirm your actual solder conditions

Flow Solder condtion:

Pre-heating:

maximum 120˚C

Soldering:

dip within 5 sec. at

260˚C soler bath

Solder by Soldering Iron:

Soldering Iron

Temperature: maximum 360˚C

Duration:

maximum 3 sec.

1. General Information

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Relays produced after the specific date code that is indicated on each data sheet are lead-free

now. Most of our signal and power relays are lead-free. Please refer to Lead-Free Status Info.

(http://www.fujitsu.com/us/downloads/MICRO/fcai/relays/lead-free-letter.pdf)

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Lead free solder paste currently used in relays is Sn-3.0Ag-0.5Cu.

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All signal and most power relays also comply with RoHS. Please refer to individual data

sheets. Relays that are RoHS compliant do not contain the 5 hazardous materials that

are restricted by RoHS directive (lead, mercury, chromium IV, PBB, PBDE).

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It has been verified that using lead-free relays in leaded assembly process will not cause any

problems (compatible).

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“LF” is marked on each outer and inner carton. (No marking on individual relays).

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To avoid leaded relays (for lead-free sample, etc.) please consult with area sales office.

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We will ship leaded relays as long as the leaded relay inventory exists.

Note: Cadmium was exempted from RoHS on October 2, 2005. (Amendment to Directive 2002/95/EC)

2. Recommended Lead Free Solder Profile

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Recommended solder paste Sn-3.0Ag-0.5Cu amd Sm-3.0 Cu-Ni (only FTR-B3 and FTR-B4 from

February 2005.

max. 20 sec.

90~20 sec.

20~30 sec.

(duration)

Cooling

Pre-heating

Soldering

Peak Temp.: max. 250°C

250

220

30

70