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TXB0102DCTR Datasheet(PDF) 1 Page - Texas Instruments |
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TXB0102DCTR Datasheet(HTML) 1 Page - Texas Instruments |
1 / 17 page www.ti.com FEATURES 1 YZP PACKAGE (BOTTOM VIEW) GND A2 B1 A1 VCCA 2 5 3 4 8 6 1 7 B2 OE VCCB 2 3 4 8 7 6 5 B1 VCCB OE A1 B2 VCCA GND A2 DCT OR DCU PACKAGE (TOP VIEW) DESCRIPTION/ORDERING INFORMATION TXB0102 2-BIT BIDIRECTIONAL VOLTAGE-LEVEL TRANSLATOR WITH AUTO DIRECTION SENSING AND ±15-kV ESD PROTECTION SCES641 – MAY 2007 • Available in the Texas Instruments NanoFree™ Packages • 1.2 V to 3.6 V on A Port and 1.65 V to 5.5 V on B Port (VCCA ≤ VCCB) • V CC Isolation Feature – If Either VCC Input Is at GND, All Outputs Are in the High-Impedance State • OE Input Circuit Referenced to V CCA • Low Power Consumption, 4-µA Max I CC • I off Supports Partial-Power-Down Mode Operation • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II • ESD Protection Exceeds JESD 22 – A Port – 2500-V Human-Body Model (A114-B) – 200-V Machine Model (A115-A) – 1500-V Charged-Device Model (C101) – B Port – 15-kV Human-Body Model (A114-B) – 200-V Machine Model (A115-A) – 1500-V Charged-Device Model (C101) This 2-bit noninverting translator uses two separate configurable power-supply rails. The A port is designed to track VCCA. VCCA accepts any supply voltage from 1.2 V to 3.6 V. The B port is designed to track VCCB. VCCB accepts any supply voltage from 1.65 V to 5.5 V. This allows for universal low-voltage bidirectional translation between any of the 1.2-V, 1.5-V, 1.8-V, 2.5-V, 3.3-V, and 5-V voltage nodes. VCCA should not exceed VCCB. When the output-enable (OE) input is low, all outputs are placed in the high-impedance state. This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. To ensure the high-impedance state during power up or power down, OE should be tied to GND through a pulldown resistor; the minimum value of the resistor is determined by the current-sourcing capability of the driver. NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. NanoFree is a trademark of Texas Instruments. PRODUCTION DATA information is current as of publication date. Copyright © 2007, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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