Figure 15. Tape dimensions.

Figure 16. Tape leader and trailer dimensions.

Convective IR Reflow Soldering

For more information on IR

reflow soldering, refer to

Application Note 1060, Surface

Mounting SMT LED Indicator

Components.

Storage Condition: 5 to 30˚C

@ 60% RH max.

Baking is required under the

condition:

a) Humidity Indicator Card is

>10% when read at 23

± 5°C.

b) Device exposed to factory

conditions <30

°C/60% RH

more than 672 hours.

Baking recommended condition:

60 +/– 5˚C for 20 hours.

END

START

THERE SHALL BE A

MINIMUM OF 160 mm

(6.3 INCH) OF EMPTY

COMPONENT POCKETS

SEALED WITH COVER

TAPE.

MOUNTED WITH

COMPONENTS

THERE SHALL BE A

MINIMUM OF 160 mm

(6.3 INCH) OF EMPTY

COMPONENT POCKETS

SEALED WITH COVER

TAPE.

MINIMUM OF

230 mm

(9.05 INCH)

MAY CONSIST

OF CARRIER

AND/OR

COVER TAPE.

NOTES:

1. ALL DIMENSIONS IN MILLIMETERS (INCHES).

2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.

10

;;

;;;

;;;

;;;;;;;

;;;;;;

8.00 ± 0.30

(0.315 ± 0.012)

USER FEED

DIRECTION

DIM. A

(SEE TABLE 1)

3.50 ± 0.05

(0.138 ± 0.002)

1.75 (0.069)

DIM. C

(SEE TABLE 1)

0.20 ± 0.05

(0.008 ± 0.002)

CARRIER TAPE

COVER TAPE

DIM. B

(SEE TABLE 1)

4.00 (0.157)

2.00 ± 0.05

(0.079 ± 0.002)

4.00 (0.157)

1.50 (0.059)

TABLE 1

DIMENSIONS IN MILLIMETERS (INCHES)

CATHODE

DIM. A

± 0.10 (± 0.004)

DIM. B

± 0.10 (± 0.004)

PART NUMBER

DIM. C

± 0.10 (± 0.004)

HSMx-C170 SERIES

2.30 (0.091)

1.45 (0.057)

0.95 (0.037)

HSMx-C190 SERIES

1.75 (0.069)

0.90 (0.035)

0.90 (0.035)

HSMx-C110 SERIES

3.40 (0.134)

1.70 (0.067)

1.20 (0.047)

HSMx-C191 SERIES

1.86 (0.073)

0.89 (0.035)

0.87 (0.034)

HSMx-C150 SERIES

3.50 (0.138)

1.88 (0.074)

1.27 (0.050)

;;

;;;

;;;

HSMx-C110

POSITION IN

CARRIER TAPE

DIM. B

(SEE TABLE 1)

DIM. A

(SEE TABLE 1)

R 1.0 ± 0.05

(0.039 ± 0.002)