3

Package Dimensions, continued

Notes:

1. Dimensions in mm.

2. Tolerance

± 0.1 mm unless otherwise noted.

Device Selection Guide

Footprint

AS AlInGaP

AS AlInGaP

AS AlInGaP

TS AlInGaP

Package

Amber

Orange

Red

Red

Description

1.6 x 0.8 x 0.8

HSMA-C190

HSML-C190

HSMC-C190

HSMZ-C190

Untinted, Diffused

2.0 x 1.25 x 0.8

HSMA-C170

HSML-C170

HSMC-C170

HSMZ-C170

Untinted, Diffused

3.2 x 1.0 x 1.5

HSMA-C110

HSML-C110

HSMC-C110

HSMZ-C110

Untinted, Nondiffused

1.6 x 0.8 x 0.6

HSMA-C191

HSML-C191

HSMC-C191

Untinted, Diffused

3.2 x 1.6 x 1.1

HSMA-C150

HSML-C150

HSMC-C150

Untinted, Diffused

Absolute Maximum Ratings

HSMA-C110/170/190/191/150

HSML-C110/170/190/191/150

Parameter

HSMC-C110/170/190/191/150

HSMZ-C110/170/190

Units

25

25

mA

Power Dissipation

60

65

mW

5

5

V

LED Junction Temperature

95

95

°C

Operating Temperature Range

–30 to +85

–30 to +85

°C

Storage Temperature Range

–40 to +85

–40 to +85

°C

Soldering Temperature

See reflow soldering profile (Figure 7 & 8)

Notes:

1. Derate linearly as shown in Figure 4.

2. Drive currents above 5 mA are recommended for best long term performance.

HSMx-C150

3.2 (0.126 )

0.5 (0.020)

0.50 ± 0.2

(0.020 ± 0.008)

0.6 (0.024)

POLARITY

CATHODE

MARK

1.1 (0.043)

0.50 ± 0.2

(0.020 ± 0.008)

2.0 (0.079)

0.8 (0.031)

LED DIE

DIFFUSED

EPOXY

PC BOARD

SOLDERING

TERMINAL

1.6 (0.063)

CATHODE LINE

NOTES:

1. ALL DIMENSIONS IN MILLIMETERS (INCHES).

2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.