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ACPM-7886-TR1 Datasheet(PDF) 10 Page - AVAGO TECHNOLOGIES LIMITED |
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ACPM-7886-TR1 Datasheet(HTML) 10 Page - AVAGO TECHNOLOGIES LIMITED |
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10 / 14 page  10 Figure 6. TD-SCDMA frame.[1] Solder Paste Recommendation The ACPM-7886 package is a lead free package that was proven to pass MSL3 when reflowed under lead free solder reflow profile. The recommended lead free solder for SMT reflow is Sn-Ag-Cu (95.5% Tin, 3.8% Silver, 0.7% Copper) or other similar Sn-Ag-Cu solders. This lead free solder paste has a melting point of 218°C (423°F), the ternary eutectic of Sn-Ag-Cu system, giving it the advantage of being the lowest melting lead free alternative. This temperature is still low enough to protect from damaging the internal circuitry during solder reflow operations provided the exposure time at peak reflow temperatures is not too excessive. In certain situations, the designer may use leaded solder paste for reflow. The recommended solder for mounting ACPM-7886 package is Sn63 (63% Sn, 37% Pb). It is a eutectic compound with a typical melting point of 183°C. Application Information Introduction The ACPM-7886 amplifier module is designed for TD- SCDMA applications in the 2010-2025MHz band. This power amplifier is able to produce excellent results for the emerging Chinese standard, TD-SCDMA. Typical ACLR performance at Vdd is 41dBc with Pout of 28dBm and 41% efficiency. Background In 1999 the China Academy of Telecommunications Technology (CATT) and Siemens proposed a new 3G standard that would rival WCDMA and CDMA2000 data rates. Time Domain Synchronous Code Domain Access (TD-SCDMA) combines both CDMA and TDMA technologies. It benefits from CDMA capacity as well as being compatible with current GSM networks. But unlike existing WCDMA, CDMA2000 and GSM networks, this new standard transmits and receives on the same frequency thus greatly increasing spectrum efficiency. Figure 6 simplifies this explanation by showing one TD-SCDMA frame with 7 slots and 16 channelization codes in each slot. ACPM-7886 Test Setup The test setup for measuring a TD-SCDMA power module resembles a GSM test. Specifically, it is very important to properly configure the timing for the test instruments and the device under test. In GSM, in order to turn ON and OFF each time slot, a controlled pin on the PA is triggered with a pulse period of 4.615ms and a 12% duty cycle (577uS). This pin is usually labeled as Vapc on most GSM PAs. |
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Similar Description - ACPM-7886-TR1 |
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