Electronic Components Datasheet Search |
|
HSDL-9100-021 Datasheet(PDF) 8 Page - AVAGO TECHNOLOGIES LIMITED |
|
HSDL-9100-021 Datasheet(HTML) 8 Page - AVAGO TECHNOLOGIES LIMITED |
8 / 12 page Baking Conditions Chart Environment less than deg C, and less than 0% RH Yes No No Yes Perform Recommended Baking Conditions Package Is Opened (Unsealed) Units in A Sealed Moisture-Proof Package No Baking Is Necessary Package Is Opened less Than hours Time from unsealing to soldering After removal from the bag, the parts should be soldered within three days if stored at the recommended storage conditions. Baking should only be done once. Recommended Storage Conditions STORAGE TEMPERATURE 10°C to 30°C Relative Humidity below 60% RH PACKAGE Temp Time In reels 0 °C ≥ hours In bulk 100 °C ≥ hours 1 °C ≥ hours 10 °C ≥ 1 hour HSDL-9100 Moisture Proof Packaging AllHSDL-9100optionsareshippedinmoistureproofpack- age. Once opened, moisture absorption begins. This part is compliant to JEDEC Level 4. Baking Conditions If the parts are not stored in dry conditions, they must be baked before reflow to prevent damage to the parts. Figure 7. Baking conditions chart |
Similar Part No. - HSDL-9100-021 |
|
Similar Description - HSDL-9100-021 |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.NET |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |