Ver: 0.3 Preliminary

Oct 19, 2006

TEL: 886-3-5788833

http://www.gmt.com.tw

8

G926

Global Mixed-mode Technology Inc.

SOP-8 (FD) Package

Note:

1. JEDEC Outline: MS-012 AA/E.P. Version: N/A

2. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions and gate burrs shall not ex-

ceed .15mm (.006in) per side.

3. Dimensions “E” does not include inter-lead flash, or protrusions inter-lead flash and protrusions shall not exceed .25mm

(.010in) per side.

DIMENSION IN MM

DIMENSION IN INCH

SYMBOL

MIN

MAX

MIN

MAX

A

1.35

1.75

0.053

0.069

A1

0.00

0.13

0.000

0.005

A2

-----

1.50

-----

0.059

B

0.41TYP

0.016TYP

D

4.80

4.98

0.189

0.196

E

3.81

3.99

0.150

0.157

e

1.27TYP

0.05TYP

H

5.80

6.20

0.228

0.244

L

0.41

1.27

0.016

0.050

θ

0°

8°

0°

8°

D1

-----

2.29

-----

0.090

E1

-----

2.29

-----

0.090

Taping Specification

PACKAGE

Q’TY/REEL

SOP-8

2,500 ea

SOP-8 (FD)

2,500 ea

GMT Inc. does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and GMT Inc. reserves the right at any time without notice to change said circuitry and specifications.

Feed Direction

Typical SOP Package Orientation

Feed Direction

Typical SOP Package Orientation

D

E

H

0.015x45º

A1

A2

A

e

B

0.004MAX.

L

θ

E1

D1

0.008TYP

SEATING PLANE

D

E

H

0.015x45º

A1

A2

A

e

B

0.004MAX.

0.004MAX.

L

θ

E1

D1

0.008TYP

SEATING PLANE