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TL496CP Datasheet(PDF) 2 Page - Texas Instruments |
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TL496CP Datasheet(HTML) 2 Page - Texas Instruments |
2 / 7 page TL496C, TL496Y 9-VOLT POWER-SUPPLY CONTROLLERS SLVS012B – AUGUST 1978 – REVISED AUGUST 1995 4–2 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TL496Y chip information This chip, when properly assembled, displays characteristics similar to the TL496C. Thermal compression or ultrasonic bonding may be used on the doped aluminum bonding pads. The chips may be mounted with conductive epoxy or a gold-silicon preform. BONDING PAD ASSIGNMENTS CHIP THICKNESS: 15 MILS TYPICAL BONDING PADS: 4 × 4 MILS MINIMUM TJmax= 150°C TOLERANCES ARE ±10% ALL DIMENSIONS ARE IN MILS 68 74 TL496Y (2) (6) (1) (3) (4) (7) (5) GND SW GND T INPUT 1C INPUT 2C INPUT FEEDBACK (8) OUTPUT (1) (2) (3) (4) (5) (6) (7) (8) |
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