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FTR-B3GB4.5Z-B10 Datasheet(PDF) 10 Page - Fujitsu Component Limited.

Part # FTR-B3GB4.5Z-B10
Description  MINIATURE RELAY 2-CONTA CT 1A (FOR SWITCHING SIGNALS)
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Manufacturer  FUJITSU [Fujitsu Component Limited.]
Direct Link  http://edevice.fujitsu.com/fmd/en/index.html
Logo FUJITSU - Fujitsu Component Limited.

FTR-B3GB4.5Z-B10 Datasheet(HTML) 10 Page - Fujitsu Component Limited.

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10
Ftr-B3 series
roHs Compliance and Lead Free relay Information
Reflow Solder condtion
3. Moisture sensitivity
l
Moisture Sensitivity Level standard is not applicable to electromechanical realys.
4. tin Whisker
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SnAgCu and SnCuNi solder is known as low risk of tin whisker. No considerable length whisker was found
by our in-house test.
We highly recommend that you confirm your actual solder conditions
Flow Solder condtion:
Pre-heating:
maximum 120˚C
Soldering:
dip within 5 sec. at
260˚C soler bath
Solder by Soldering Iron:
Soldering Iron
Temperature: maximum 360˚C
Duration:
maximum 3 sec.
1. General Information
l
Relays produced after the specific date code that is indicated on each data sheet are lead-free
now. Most of our signal and power relays are lead-free. Please refer to Lead-Free Status Info.
(http://www.fujitsu.com/us/downloads/MICRO/fcai/relays/lead-free-letter.pdf)
l
Lead free solder paste currently used in relays is Sn-3.0Ag-0.5Cu. From February 2005 forward
Sn-3.0CU-Ni will be used for the FTR-B3 and FTR-B4 series relays.
l
All signal and most power relays also comply with RoHS. Please refer to individual data
sheets. Relays that are RoHS compliant do not contain the 5 hazardous materials that
are restricted by RoHS directive (lead, mercury, chromium IV, PBB, PBDE).
l
It has been verified that using lead-free relays in leaded assembly process will not cause any
problems (compatible).
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“LF” is marked on each outer and inner carton. (No marking on individual relays).
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To avoid leaded relays (for lead-free sample, etc.) please consult with area sales office.
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We will ship leaded relays as long as the leaded relay inventory exists.
Note: Cadmium was exempted from RoHS on October 21, 2005. (Amendment to Directive 2002/95/EC)
2. Recommended Lead Free Solder Profile
l
Recommended solder paste Sn-3.0Ag-0.5Cu amd Sm-3.0 Cu-Ni (only FTR-B3 and FTR-B4 from
February 2005.
max. 120 sec.
90~120 sec.
20~30 sec.
(duration)
Cooling
Pre-heating
Soldering
PeakTemp.: max. 250°C
250
220
130
170


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