MMBT2222_07 datasheet(2/2 Pages) DIOTEC

Part #	MMBT2222

Description	Surface Mount Si-Epi-Planar Switching Transistors

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Manufacturer	DIOTEC [Diotec Semiconductor]

Direct Link	http://www.diotec.com

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MMBT2222 / MMBT2222A

Min.

Typ.

Max.

Collector-Emitter saturation voltage – Kollektor-Sättigungsspannung 2)

IC = 150 mA, IB = 15 mA

MMBT2222

MMBT2222A

VCEsat

–

0.4 V

0.3 V

IC = 500 mA, IB = 50 mA

MMBT2222

MMBT2222A

VCEsat

–

1.6 V

1.0 V

Base-Emitter saturation voltage – Basis-Sättigungsspannung 2)

IC = 150 mA, IB = 15 mA

MMBT2222

MMBT2222A

VBEsat

–

0.65 V

–

1.3 V

1.2 V

IC = 500 mA, IB = 50 mA

MMBT2222

MMBT2222A

VBEsat

–

2.6 V

2.0 V

Collector-Base cutoff current – Kollektor-Basis-Reststrom

VCB = 50 V, (E open)

VCB = 60 V, (E open)

MMBT2222

MMBT2222A

ICBO

–

10 nA

VCB = 50 V, Tj = 125°C, (E open)

VCB = 60 V, Tj = 125°C, (E open)

MMBT2222

MMBT2222A

ICBO

–

10 µA

Emitter-Base cutoff current – Emitter-Basis-Reststrom

VEB = 3 V, (C open)

MMBT2222A

IEB0

–

–-

100 nA

Gain-Bandwidth Product – Transitfrequenz

VCE = 20 V, IC = 20 mA, f = 100 MHz

fT

250 MHz

–

Collector-Base Capacitance – Kollektor-Basis-Kapazität

VCB = 10 V, IE = ie = 0, f = 1 MHz

CCBO

––

8 pF

Emitter-Base Capacitance – Emitter-Basis-Kapazität

VEB = 0.5 V, IC = ic = 0, f = 1 MHz

CEBO

–

25 pf

Noise figure – Rauschzahl

VCE = 10 V, IC = 100 µA, RG = 1 kΩ, f = 1 kHz MMBT2222A

F

–

4 dB

Switching times – Schaltzeiten (between 10% and 90% levels)

delay time

rise time

VCC = 3 V, VBE = 0.5 V

IC = 150 mA, IB1 = 15mA

td

–

10 ns

tr

–

25 ns

storage time

fall time

VCC = 3 V, IC = 150 mA,

IB1 = IB2 = 15 mA

ts

–

225 ns

tf

–

60 ns

Thermal resistance junction to ambient air

Wärmewiderstand Sperrschicht – umgebende Luft

RthA

< 420 K/W 1)

Recommended complementary PNP transistors

Empfohlene komplementäre PNP-Transistoren

MMBT2709 / MMBT2709A

Marking - Stempelung

MMBT2222 = 1B

MMBT2222A = M1P

2

Tested with pulses tp = 300 µs, duty cycle ≤ 2% – Gemessen mit Impulsen tp = 300 µs, Schaltverhältnis ≤ 2%

1

Mounted on P.C. board with 3 mm2 copper pad at each terminal

Montage auf Leiterplatte mit 3 mm2 Kupferbelag (Lötpad) an jedem Anschluss

2

http://www.diotec.com/

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