PACKAGING INFORMATION

Orderable Device

Status

(1)

Package

Type

Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

MSL Peak Temp

(3)

74CBTLV3251DBQRE4

ACTIVE

SSOP/

QSOP

DBQ

16

2500 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

74CBTLV3251DBQRG4

ACTIVE

SSOP/

QSOP

DBQ

16

2500 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

74CBTLV3251DGVRE4

ACTIVE

TVSOP

DGV

16

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

74CBTLV3251DGVRG4

ACTIVE

TVSOP

DGV

16

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

74CBTLV3251PWRE4

ACTIVE

TSSOP

PW

16

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

74CBTLV3251PWRG4

ACTIVE

TSSOP

PW

16

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

74CBTLV3251RGYRG4

ACTIVE

QFN

RGY

16

1000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

SN74CBTLV3251D

ACTIVE

SOIC

D

16

40

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74CBTLV3251DBQR

ACTIVE

SSOP/

QSOP

DBQ

16

2500 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

SN74CBTLV3251DE4

ACTIVE

SOIC

D

16

40

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74CBTLV3251DG4

ACTIVE

SOIC

D

16

40

Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74CBTLV3251DGVR

ACTIVE

TVSOP

DGV

16

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74CBTLV3251DR

ACTIVE

SOIC

D

16

2500 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74CBTLV3251DRE4

ACTIVE

SOIC

D

16

2500 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74CBTLV3251DRG4

ACTIVE

SOIC

D

16

2500 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74CBTLV3251PWR

ACTIVE

TSSOP

PW

16

2000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

SN74CBTLV3251RGYR

ACTIVE

QFN

RGY

16

1000 Green (RoHS &

no Sb/Br)

CU NIPDAU

Level-2-260C-1 YEAR

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and

package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS

compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame

PACKAGE OPTION ADDENDUM

www.ti.com

24-May-2007

Addendum-Page 1