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TLC7226CDW Datasheet(PDF) 1 Page - Texas Instruments |
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TLC7226CDW Datasheet(HTML) 1 Page - Texas Instruments |
1 / 25 page TLC7226C, TLC7226I, TLC7226M QUADRUPLE 8BIT DIGITALTOANALOG CONVERTERS SLAS060E − JANUARY 1995 − REVISED JANUARY 2003 1 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 features D Four 8-Bit D/A Converters D Microprocessor Compatible D TTL/CMOS Compatible D Single Supply Operation Possible D CMOS Technology applications D Process Control D Automatic Test Equipment D Automatic Calibration of Large System Parameters, e.g. Gain/Offset description The TLC7226C, TLC7226I, and TLC7226M consist of four 8-bit voltage-output digital-to- analog converters (DACs) with output buffer amplifiers and interface logic on a single monolithic chip. Separate on-chip latches are provided for each of the four DACs. Data is transferred into one of these data latches through a common 8-bit TTL /CMOS-compatible 5-V input port. Control inputs A0 and A1 determine which DAC is loaded when WR goes low. The control logic is speed compatible with most 8-bit microprocessors. Each DAC includes an output buffer amplifier capable of sourcing up to 5 mA of output current. The TLC7226 performance is specified for input reference voltages from 2 V to VDD − 4 V with dual supplies. The voltage mode configuration of the DACs allows the TLC7226 to be operated from a single power supply rail at a reference of 10 V. The TLC7226 is fabricated in a LinBiCMOS process that has been specifically developed to allow high-speed digital logic circuits and precision analog circuits to be integrated on the same chip. The TLC7226 has a common 8-bit data bus with individual DAC latches. This provides a versatile control architecture for simple interface to microprocessors. All latch-enable signals are level triggered. Combining four DACs, four operational amplifiers, and interface logic into either a 0.3-inch wide, 20-terminal dual-in-line IC (DIP) or a small 20-terminal small-outline IC (SOIC) allows a dramatic reduction in board space requirements and offers increased reliability in systems using multiple converters. The Leadless Ceramic Chip Carrier (LCCC) package provides for operation at military temperature range. The pinout is aimed at optimizing board layout with all of the analog inputs and outputs at one end of the package and all of the digital inputs at the other. Copyright 2003, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. LinBiCMOS is a trademark of Texas Instruments. 1 2 3 4 5 6 7 8 9 10 20 19 18 17 16 15 14 13 12 11 OUTB OUTA VSS REF AGND DGND DB7 DB6 DB5 DB4 OUTC OUTD VDD A0 A1 WR DB0 DB1 DB2 DB3 DW OR N PACKAGE (TOP VIEW) 19 20 1 32 17 18 16 15 14 13 12 11 9 10 5 4 6 7 8 VDD A0 A1 WR DB0 REF AGND DGND DB7 DB6 FK PACKAGE (TOP VIEW) LinBiCMOS is a trademark of Texas Instruments. |
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