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REG1117A-1.8G4 Datasheet(PDF) 10 Page - Burr-Brown (TI) |
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REG1117A-1.8G4 Datasheet(HTML) 10 Page - Burr-Brown (TI) |
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10 / 35 page  REG1117 REG1117A SBVS001D − OCTOBER 1992 − REVISED JULY 2004 www.ti.com 10 The SOT-223 package derives heat sinking from conduction through its copper leads, especially the large mounting tab. These must be soldered to a circuit board with a substantial amount of copper remaining, as shown in Figure 5. Circuit board traces connecting the tab and the leads should be made as large as practical. The mounting tab of both packages is electrically connected to VOUT. Total Area: 50 x 50mm 35 x 17 mm 16 x 10 mm 16 x 10 mm Without backside copper: JA ≈ 59_ C/W q With solid backside copper: JA ≈ 49_ C/W q Figure 5. SOT-223 Circuit Board Layout Example Other nearby circuit traces, including those on the back side of the circuit board, help conduct heat away from the device, even though they may not be electrically connected. Make all nearby copper traces as wide as possible and leave only narrow gaps between traces. Table 1 shows approximate values of qJA for various circuit board and copper areas for the SOT-223 package. Nearby heat dissipating components, circuit board mounting conditions, and ventilation can dramatically affect the actual qJA. Proper heat sinking significantly increases the maximum power dissipation at a given ambient temperature, as shown in Figure 6. Table 1. SOT-223 qJA for Various Board Configurations (1) SOT-223 THERMAL TOTAL PC BOARD TOPSIDE(1) COPPER BACKSIDE COPPER THERMAL RESISTANCE JUNCTION- BOARD AREA COPPER AREA COPPER AREA JUNCTION- TO-AMBIENT 2500mm2 2500mm2 2500mm2 46 °C/W 2500mm2 1250mm2 2500mm2 47 °C/W 2500mm2 950mm2 2500mm2 49 °C/W 2500mm2 2500mm2 0 51 °C/W 2500mm2 1800mm2 0 53 °C/W 1600mm2 600mm2 1600mm2 55 °C/W 2500mm2 1250mm2 0 58 °C/W 2500mm2 915mm2 0 59 °C/W 1600mm2 600mm2 0 67 °C/W 900mm2 340mm2 900mm2 72 °C/W 900mm2 340mm2 0 85 °C/W (1) Tab is attached to the topside copper. SOLDERING METHODS Both REG1117 packages are suitable for infrared reflow and vapor-phase reflow soldering techniques. The high rate of temperature change that occurs with wave soldering or hand soldering can damage the REG1117. INSPEC Abstract Number: B91007604, C91012627. Kelly, E.G. “Thermal Characteristics of Surface 5WK9 Ω Packages.” The Proceedings of SMTCON. Surface Mount Technology Conference and Exposition: Competitive Surface Mount Technology, April 3−6, 1990, Atlantic City, NJ, USA. Abstract Publisher: IC Manage, 1990, Chicago, IL, USA. 6 5 4 3 2 1 0 0 255075 100 125 Ambient Temperature ( _C) MAXIMUM POWER DISSIPATION vs AMBIENT TEMPERATURE P D =(TJ (max) − TA)/ JA T J (max) = 150_ C q DDPAK SOT−223 JA =85_ C/W (340mm2 topside copper, no backside copper) q JA =46_ C/W (2500mm2 topside and backside copper) q JA =27_ C/W (4in2 one oz copper mounting pad) q JA =65_ C/W (no heat sink) q Figure 6. Maximum Power Dissipation versus Ambient Temperature |
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