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REG1117G4 Datasheet(PDF) 9 Page - Burr-Brown (TI) |
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REG1117G4 Datasheet(HTML) 9 Page - Burr-Brown (TI) |
9 / 35 page REG1117 REG1117A SBVS001D − OCTOBER 1992 − REVISED JULY 2004 www.ti.com 9 A simple experiment will determine whether the maximum recommended junction temperature is exceeded in an actual circuit board and mounting configuration: Increase the ambient temperature above that expected in normal operation until the device’s thermal shutdown is activated. If this occurs at more than 40 °C above the maximum expected ambient temperature, then TJ will be less than 125 °C during normal operation. The internal protection circuitry of the REG1117 was designed to protect against overload conditions. It was not intended to replace proper heat sinking. Continuously running the REG1117 into thermal shutdown will degrade reliability. LAYOUT CONSIDERATIONS The DDPAK (REG1117F-3.3 and REG1117FA) is a surface-mount power package that has excellent thermal characteristics. For best thermal performance, the mounting tab should be soldered directly to a circuit board copper area, as shown in Figure 3. Increasing the copper area improves heat dissipation. Figure 4 shows typical thermal resistance from junction-to-ambient as a function of the copper area. 3−Lead DDPAK(1) NOTE: (1) For improved thermal performance increase footprint area. See Figure 4 (Thermal Resistance vs Circuit Board Copper Area). All measurements in inches. 0.51 0.10 0.155 0.05 Figure 3. DDPAK Footprint THERMAL RESISTANCE vs CIRCUIT BOARD COPPER AREA 60 50 40 30 20 10 01 2 3 45 Copper Area (inches2) REG1117F DDPAK Surface Mount Package 1oz copper Circuit Board Copper Area REG1117F DDPAK Surface−Mount Package Figure 4. DDPAK Thermal Resistance versus Circuit Board Copper Area |
Similar Part No. - REG1117G4 |
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Similar Description - REG1117G4 |
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