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Internet Data Sheet Rev. 1.63, 2006-09 3 03062006-PFFJ-YJY2 HYB25D512[40/16/80]0B[E/F/C/T](L) Double-Data-Rate SDRAM 1Overview This chapter gives an overview of the 512-Mbit Double-Data-Rate SDRAM product family and describes its main characteristics 1.1 Features • Double data rate architecture: two data transfers per clock cycle • Bidirectional data strobe (DQS) is transmitted and received with data, to be used in capturing data at the receiver • DQS is edge-aligned with data for reads and is center-aligned with data for writes • Differential clock inputs (CK and CK) • Four internal banks for concurrent operation • Data mask (DM) for write data • DLL aligns DQ and DQS transitions with CK transitions • Commands entered on each positive CK edge; data and data mask referenced to both edges of DQS • Burst Lengths: 2, 4, or 8 • CAS Latency: (1.5), 2, 2.5, 3 • Auto Pre charge option for each burst access • Auto Refresh and Self Refresh Modes • RAS-lockout supported t RAP=tRCD •7.8 µs Maximum Average Periodic Refresh Interval • 2.5 V (SSTL_2 compatible) I/O • V DDQ = 2.5 V ± 0.2 V and 2.6 V ± 0.1 V for DDR400 • V DD = 2.5 V ± 0.2 V and 2.6 V ± 0.1 V for DDR400 • P-TFBGA-60 and P-TSOPII-66 package TABLE 1 Performance Part Number Speed Code –5 –6 –7 Unit Speed Grade Component DDR400B DDR333B DDR266A — Module PC3200–3033 PC2700–2533 PC2100–2033 — max. Clock Frequency @CL3 f CK3 200 166 – MHz @CL2.5 f CK2.5 166 166 143 MHz @CL2 f CK2 133 133 133 MHz |
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