Part Name
         Description
HYB25D512800BT

 512-Mbit Double-Data-Rate SDRAM ( 38 Page)


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Internet Data Sheet
Rev. 1.63, 2006-09
3
03062006-PFFJ-YJY2
HYB25D512[40/16/80]0B[E/F/C/T](L)
Double-Data-Rate SDRAM
1Overview
This chapter gives an overview of the 512-Mbit Double-Data-Rate SDRAM product family and describes its main
characteristics
1.1
Features
• Double data rate architecture: two data transfers per clock cycle
• Bidirectional data strobe (DQS) is transmitted and received with data, to be used in capturing data at the receiver
• DQS is edge-aligned with data for reads and is center-aligned with data for writes
• Differential clock inputs (CK and CK)
• Four internal banks for concurrent operation
• Data mask (DM) for write data
• DLL aligns DQ and DQS transitions with CK transitions
• Commands entered on each positive CK edge; data and data mask referenced to both edges of DQS
• Burst Lengths: 2, 4, or 8
• CAS Latency: (1.5), 2, 2.5, 3
• Auto Pre charge option for each burst access
• Auto Refresh and Self Refresh Modes
• RAS-lockout supported
t
RAP=tRCD
•7.8
µs Maximum Average Periodic Refresh Interval
• 2.5 V (SSTL_2 compatible) I/O
V
DDQ = 2.5 V ± 0.2 V and 2.6 V ± 0.1 V for DDR400
V
DD = 2.5 V ± 0.2 V and 2.6 V ± 0.1 V for DDR400
• P-TFBGA-60 and P-TSOPII-66 package
TABLE 1
Performance
Part Number Speed Code
–5
–6
–7
Unit
Speed Grade
Component
DDR400B
DDR333B
DDR266A
Module
PC3200–3033
PC2700–2533
PC2100–2033
max. Clock
Frequency
@CL3
f
CK3
200
166
MHz
@CL2.5
f
CK2.5
166
166
143
MHz
@CL2
f
CK2
133
133
133
MHz
1  2  3  4  5  6  7  8  9  10  11  12  13  14  15  16  17  18  19  20  21  22  23  24  25  26  27  28  29  30  31  32  33  34  35  36  37  38 



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