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HYS64T32900EDL-3-B2 Datasheet(PDF) 5 Page - Qimonda AG |
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HYS64T32900EDL-3-B2 Datasheet(HTML) 5 Page - Qimonda AG |
5 / 86 page Internet Data Sheet Rev. 1.1, 2007-01 5 08212006-PKYN-2H1B HYS64T[32/64/128]xxxEDL–[25F/…/3.7](–)B2 Small Outlined DDR2 SDRAM Modules TABLE 3 Address Format TABLE 4 Components on Modules PC2–4200 HYS64T32000EDL–3.7–B2 HYS64T32900EDL–3.7–B2 256 MB 1R × 16 PC2–4200S–444–12–C0 1 Rank, Non-ECC 512 Mbit ( ×16) HYS64T64020EDL–3.7–B2 HYS64T64920EDL–3.7–B2 512 MB 2R × 16 PC2–4200S–444–12–A0 2 Rank, Non-ECC 512 Mbit ( ×16) HYS64T128021EDL–3.7B2 HYS64T128921EDL–3.7B2 1GB 2R × 8 PC2-4200S–444–12–E0 2 Rank, Non-ECC 512 Mbit ( ×8) 1) All Product Type numbers end with a place code, designating the silicon die revision. Example: HYS64T64020EDL–3.7–B2, indicating Rev. “B” dies are used for DDR2 SDRAM components. For all Qimonda DDR2 module and component nomenclature see Chapter 6 of this data sheet. 2) The Compliance Code is printed on the module label and describes the speed grade, for example “PC2–4200S–444–12–A0”, where 4200S means Small Outlined Unbuffered DIMM modules with 4.26 GB/sec Module Bandwidth and “444-12” means Column Address Strobe (CAS) latency = 4, Row Column Delay (RCD) latency = 4 and Row Precharge (RP) latency = 4 using the latest JEDEC SPD Revision 1.2 and produced on the Raw Card “A”. DIMM Density Module Organization Memory Ranks ECC/ Non-ECC # of SDRAMs # of row/bank/column bits Raw Card 256 MByte 32M × 64 1 Non-ECC 4 13/2/10 C 512 MByte 64M × 64 2 Non-ECC 8 13/2/10 A 1 GByte 128M × 64 2 Non-ECC 16 14/2/10 E Product Type1)2) 1) For a detailed description of all functionalities of the DRAM components on these modules see the component data sheet. 2) Green Product DRAM Components2) DRAM Density DRAM Organisation HYS64T32000EDL HYS64T32900EDL HYB18T512160B2F 512 Mbit 32M × 16 HYS64T64020EDL HYS64T64920EDL HYB18T512160B2F 512 Mbit 32M × 16 HYS64T128021EDL HYS64T128921EDL HYB18T512800B2F 512 Mbit 64M × 8 Product Type1) Compliance Code2) Description SDRAM Technology |
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