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HYS64T128021HDL-25F-B Datasheet(PDF) 5 Page - Qimonda AG |
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HYS64T128021HDL-25F-B Datasheet(HTML) 5 Page - Qimonda AG |
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5 / 70 page  Internet Data Sheet Rev. 1.1, 2006-10 5 03292006-5LTN-QML0 HYS64T[32/64/128]xxxHDL-[25F/2.5/3/3S/3.7/5]-B SO-DIMM DDR2 SDRAM Module TABLE 3 Address Format TABLE 4 Components on Modules PC2–3200 HYS64T32000HDL–5–B 256 MB 1R ×16 PC2–3200S–333–12–C0 1 Rank, Non-ECC 512 Mbit ( ×16) HYS64T64020HDL–5–B 512 MB 1R ×16 PC2–3200S–333–12–A0 2 Rank, Non-ECC 512 Mbit ( ×16) HYS64T128021HDL–5–B 1 GB 2Rx8 PC2-3200S–333–12–E0 2 Rank, Non-ECC 512 Mbit ( ×8) 1) All Product Type numbers end with a place code, designating the silicon die revision. Example: HYS64T64020HDL–3.7–B, indicating Rev. “B” dies are used for DDR2 SDRAM components. For all Qimonda DDR2 module and component nomenclature see Chapter 6 of this data sheet. 2) The Compliance Code is printed on the module label and describes the speed grade, for example “PC2–4200S–444–12–A0”, where 4200S means small-outlined unbuffered DIMM modules with 4.26 GB/sec Module Bandwidth and “444-12” means Column Address Strobe (CAS) latency = 4, Row Column Delay (RCD) latency = 4 and Row Precharge (RP) latency = 4 using the latest JEDEC SPD Revision 1.2 and produced on the Raw Card “A”. DIMM Density Module Organization Memory Ranks ECC/ Non-ECC # of SDRAMs # of row/bank/column bits Raw Card 256 MByte 32M × 64 1 Non-ECC 4 13/2/10 C 512 MByte 64M × 64 2 Non-ECC 8 13/2/10 A 1 GByte 128M × 64 2 Non-ECC 16 14/2/10 E Product Type1) 1) Green Product DRAM Components1) DRAM Density DRAM Organisation Note2) 2) For a detailed description of all functionalities of the DRAM components on these modules see the component data sheet. HYS64T32000HDL HYS64T32900HDL HYB18T512160BF 512 Mbit 32M × 16 HYS64T64020HDL HYS64T64920HDL HYB18T512160BF 512 Mbit 32M × 16 HYS64T128021HDL HYS64T128921HDL HYB18T512800BF 512 Mbit 64M × 8 Product Type1) Compliance Code2) Description SDRAM Technology |
Similar Part No. - HYS64T128021HDL-25F-B |
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Similar Description - HYS64T128021HDL-25F-B |
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