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TLE2021MFKB Datasheet(PDF) 6 Page - Texas Instruments |
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TLE2021MFKB Datasheet(HTML) 6 Page - Texas Instruments |
6 / 72 page TLE202x, TLE202xA, TLE202xB, TLE202xY EXCALIBUR HIGHSPEED LOW POWER PRECISION OPERATIONAL AMPLIFIERS SLOS191C − FEBRUARY 1997 − REVISED APRIL 2007 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TLE2024Y chip information This chip, when properly assembled, displays characteristics similar to the TLE2024. Thermal compression or ultrasonic bonding may be used on the doped aluminum-bonding pads. This chip may be mounted with conductive epoxy or a gold-silicon preform. BONDING PAD ASSIGNMENTS CHIP THICKNESS: 15 MILS TYPICAL BONDING PADS: 4 × 4 MILS MINIMUM TJmax = 150°C TOLERANCES ARE ±10%. ALL DIMENSIONS ARE IN MILS. PIN (11) IS INTERNALLY CONNECTED TO BACKSIDE OF CHIP. + − 1OUT 1IN + 1IN − VCC + (4) (6) (3) (2) (5) (1) − + (7) 2IN + 2IN − 2OUT (11) VCC −/GND + − 3OUT 2IN + 3IN − (13) (10) (9) (12) (8) − + (14) 4OUT 4IN + 4IN − 100 140 |
Similar Part No. - TLE2021MFKB |
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Similar Description - TLE2021MFKB |
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