Preliminary Internet Data Sheet

Rev. 0.5, 2007-05

3

05212007-7F24-MITO

HYS64T128020EML-[3S/3.7/5]-B

Unbuffered DDR2 SDRAM MicroDIMM Modules

1Overview

This chapter gives an overview of the 214-Pin Unbuffered DDR2 SDRAM MicroDIMM Modules product family and describes

its main characteristics.

1.1

Features

List of Micro-DIMM features

• 214-Pin PC-5300,PC2-4200 and PC2-3200 DDR2

SDRAM memory modules for use as main memory when

installed in systems such as mobile personal computers.

• 128M

× 64 module organisation and 64M ×16 chip

organisation

• JEDEC standard Double-Data-Rate-Two Synchronous

DRAMs (DDR2 SDRAM) with a single + 1.8 V (± 0.1 V)

power supply

• 1 GB modules built with 1 Gb DDR2 SDRMs in chipsize

packages PG-TFBGA-84.

• Programmable CAS Latencies (3, 4 and 5), Burst Length

(8 & 4)

• Burst Refresh, Distributed Refresh and Self Refresh

• All inputs and outputs SSTL_18 compatible

• OCD (Off-Chip Driver Impedance Adjustment) and ODT

(On-Die Termination)

• Micro-DIMM Dimensions (nominal): 30 mm high, 54.0 mm

wide

• Based on JEDEC standard reference layouts Raw Card

“A”

TABLE 1

Performance Table

1) RoHS Compliant Product: Restriction of the use of certain hazardous substances (RoHS) in electrical and electronic equipment as defined

in the directive 2002/95/EC issued by the European Parliament and of the Council of 27 January 2003. These substances include mercury,

lead, cadmium, hexavalent chromium, polybrominated biphenyls and polybrominated biphenyl ethers.

Product Type Speed Code

-3S

–3.7

–5

Units

Speed Grade

PC2-5300

PC2–4200

PC2–3200

—

CAS-RCD-RP latencies

5-5-5

4-4-4

3-3-3

Max. Clock Frequency

@CL5

f

CK5

333

266

200

MHz

@CL4

f

CK4

266

266

200

MHz

@CL3

f

CK3

200

200

200

MHz

Min. RAS-CAS-Delay

t

RCD

15

15

15

ns

Min. Row Precharge Time

t

RP

15

15

15

ns

Min. Row Active Time

t

RAS

45

45

40

ns

Min. Row Cycle Time

t

RC

60

60

55

ns