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HYS72T1G042ER-5-B Datasheet(PDF) 4 Page - Qimonda AG |
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HYS72T1G042ER-5-B Datasheet(HTML) 4 Page - Qimonda AG |
4 / 31 page Internet Data Sheet Rev. 1.0, 2007-04 4 04242007-NQ2Z-YM3O HYS72T1G042ER–5–B Registerd DDR2 SDRAM Module 1.2 Description The QIMONDA HYS72T1G042ER–5–B module family are Registered DIMM modules “RDIMMs” with 42 mm height based on DDR2 technology. DIMMs are available ECC modules in 1024M × 72 (8 GB) organization and density, intended for mounting into 240-pin connector sockets. The memory array is designed with stacked 1-Gbit Double- Data-Rate-Two (DDR2) Synchronous DRAMs. All control and address signals are re-driven on the DIMM using register devices and a PLL for the clock distribution. This reduces capacitive loading to the system bus, but adds one cycle to the SDRAM timing. Decoupling capacitors are mounted on the PCB board. The DIMMs feature serial presence detect based on a serial E2PROM device using the 2-pin I2C protocol. The first 128 bytes are programmed with configuration data and are write protected; the second 128 bytes are available to the customer. TABLE 2 Ordering Information for RoHS Compliant Products TABLE 3 Address Format TABLE 4 Components on Modules Product Type1) 1) All Product Type numbers end with a place code, designating the silicon die revision. Example: HYS72T1G042ER–5–B, indicating Rev. “B” dies are used for DDR2 SDRAM components. For all Qimonda DDR2 module and component nomenclature see Chapter 6 of this data sheet. Compliance Code2) 2) The Compliance Code is printed on the module label and describes the speed grade, for example “4R ×4 PC2–3200R–333–12–ZZ”, where 3200R means Registered DIMM modules with 3.2 GB/sec Module Bandwidth and “333-12” means Column Address Strobe (CAS) latency = 4, Row Column Delay (RCD) latency = 4 and Row Precharge (RP) latency = 4 using the latest JEDEC SPD Revision 1.2 and produced on the Raw Card “Z”. Description SDRAM Technology PC2–3200 HYS72T1G042ER–5–B 8 GB 4R ×4 PC2–3200R–333–12–ZZ 4 Ranks, ECC 2 × 256Mbit( × 4 ) DIMM Density Module Organization Memory Ranks ECC/ Non-ECC # of SDRAMs # of row/bank/column bits Raw Card 8 GByte 1024M × 72 4 ECC 36 14/3/11 Z Product Type1) 1) Green Product DRAM Components1) DRAM Density DRAM Organisation Note2) 2) For a detailed description of all functionalities of the DRAM components on these modules see the component data sheet. HYS72T1G042ER HYB18T2G402BF 1 Gbit 2 × 256M × 4 |
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