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RT9012-CMGQW Datasheet(PDF) 10 Page - Richtek Technology Corporation |
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RT9012-CMGQW Datasheet(HTML) 10 Page - Richtek Technology Corporation |
10 / 11 page RT9012 Preliminary 10 DS9012-06 August 2007 www.richtek.com For recommended operating conditions specification of RT9012, where TJ(MAX) is the maximum junction temperature of the die (125 °C) and TA is the operated ambient temperature. The junction to ambient thermal resistance ( θJA is layout dependent) for WDFN-8L 2x2 package is 108 °C/W on the standard JEDEC 51-3 single- layer thermal test board. The maximum power dissipation at TA = 25 °C can be calculated by following formula : PD(MAX) = ( 125 °C − 25°C ) / 108 = 0.926W for WDFN-8L 2x2 packages The maximum power dissipation depends on operating ambient temperature for fixed TJ(MAX) and thermal resistance θJA . For RT9012 packages, the Figure 3 of derating curves allows the designer to see the effect of rising ambient temperature on the maximum power allowed. Figure 3. Derating Curves for RT9012 Packages Power Dissipation vs. Ambient Temperature 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0 25 50 75 100 125 Ambient Temperature ( °C) WDFN-8L 2x2 |
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