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RT9017-2HGBR Datasheet(PDF) 9 Page - Richtek Technology Corporation |
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RT9017-2HGBR Datasheet(HTML) 9 Page - Richtek Technology Corporation |
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9 / 12 page  RT9017 Preliminary 9 DS9017-03 August 2007 www.richtek.com Figure 3. Derating Curve for Packages For continuous operation, do not exceed absolute maximum operation junction temperature 125 °C. The power dissipation definition in device is : PD = (VIN − VOUT) x IOUT + VIN x IQ The maximum power dissipation depends on the thermal resistance of IC package, PCB layout, the rate of surroundings airflow and temperature difference between junction to ambient. The maximum power dissipation can be calculated by following formula : PD(MAX) = ( TJ(MAX) - TA ) / θJA Where TJ(MAX) is the maximum operation junction temperature 125 °C, TAis the ambient temperature and the θJA is the junction to ambient thermal resistance. For recommended operating conditions specification of RT9017, where TJ(MAX) is the maximum junction temperature of the die (125 °C) and TA is the maximum ambient temperature. The junction to ambient thermal resistance ( θJA is layout dependent) for SOT-23-3/SOT- 23-5 package is 250 °C/W and WDFN-6L 2x2 package is 165 °C/W on standard JEDEC 51-3 thermal test board. The maximum power dissipation at TA = 25 °C can be calculated by following formula : PD(MAX) = (125 °C−25°C)/250 = 400 mW (SOT-23-3/ SOT-23-5) PD(MAX) = (125 °C−25°C)/333 = 300 mW (SC-70-5) The maximum power dissipation depends on operating ambient temperature for fixed TJ(MAX) and thermal resistance θJA. For RT9017 packages, the Figure 3. of derating curves allows the designer to see the effect of rising ambient temperature on the maximum power allowed. 0 100 200 300 400 500 600 700 0 25 50 75 100 125 150 Ambient Temperature (°C) SOT-23-3/ SOT-23-5 WDFN-6L 2x2 ( °C) |
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