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NE555 Datasheet(PDF) 3 Page - Texas Instruments

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Part No. NE555
Description  PRECISION TIMERS SE555C FROM TI IS NOT RECOMMENDED FOR NEW DESIGNS
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Maker  TI [Texas Instruments]
Homepage  http://www.ti.com
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SLFS022 – D1669, SEPTEMBER 1973—REVISED FEBRUARY 1992
NE555Y
PRECISION TIMERS
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
3
chip information
These chips, properly assembled, display characteristics similar to the NE555 (see electrical table for NE555Y).
Thermal compression or ultrasonic bonding may be used on the doped aluminum bonding pads. Chips may be
mounted with conductive epoxy or a gold-silicon preform.
GND
RESET
(4)
CONT
VCC
(8)
1
THRES
TRIG
R
R
R
DISCH
OUT
S
R
R1
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4
× 4 MINIMUM
TJ max = 150° C
TOLERANCES ARE
± 10%
ALL DIMENSIONS ARE IN MILS
PIN (1) INTERNALLY CONNECTED
TO BACKSIDE OF CHIP
(5)
(6)
(2)
(1)
(7)
(3)
BONDING PAD ASSIGNMENTS
41
42
(1)
(2)
(3)
(4)
(8)
(7)
(6)
(5)




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