CPC1709

www.clare.com

3

R02

Parameter

Conditions

Symbol

Min

Typ

Max

Units

Thermal Resistance (junction to case)

-

-

-

0.3

°C/W

Thermal Resistance (junction to ambient)

Free air

-

33

-

°C/W

Junction Temperature (operation)

-

T

J

-40

-

100

°C

Thermal Characteristics

Thermal Management

Device high current characterization was performed using Kunze heat sink KU 1-159, phase change thermal

interface material KU-ALC 5, and transistor clip KU 4-499/1. This combination provided an approximate

junction-to-ambient thermal resistance of 12.5°C/W.

Heat Sink Calculation

Higher load currents are possible by using lower thermal resistance heat sink combinations.

R

(T

2

•

R

θJC

I

L

2

- R

θJC

T

T

I

I

R

R

* Elevated junction temperature reduces semiconductor lifetime.

Heat Sink Rating