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CPC1909J Datasheet(PDF) 1 Page - Clare, Inc.

Part # CPC1909J
Description  ISOPLUS??264 Power Relay
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Manufacturer  CLARE [Clare, Inc.]
Direct Link  http://www.clare.com
Logo CLARE - Clare, Inc.

CPC1909J Datasheet(HTML) 1 Page - Clare, Inc.

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www.clare.com
DS-CPC1909-R03
1
CPC1909
ISOPLUS™-264 Power Relay
e3
RoHS
2002/95/EC
Part Number
Description
CPC1909J
ISOPLUS-264 (25 per tube)
Parameter
Rating
Units
Blocking Voltage
60
V
P
Load Current, T
A=25ºC
With 5°C/W Heat Sink
15
A
rms
No Heat Sink
6.5
On-resistance
0.1
Ω
RθJC
0.3
ºC/W
Applications
Features
Description
Ordering Information
Pin Configuration
Industrial Controls
Motor Control
Robotics
Medical Equipment—Patient/Equipment Isolation
Instrumentation
Multiplexers
Data Acquisition
Electronic Switching
I/O Subsystems
Meters (Watt-Hour, Water, Gas)
Transportation Equipment
Aerospace/Defense
Compact ISOPLUS-264 Power Package
Low Thermal Resistance (0.3 °C/W)
15A
rms Load Current with 5°C/W Heat Sink
Electrically Non-conductive Thermal Pad for Heat
Sink Applications
Low Drive Power Requirements
Arc-Free With No Snubbing Circuits
2500V
rms Input/Output Isolation
No EMI/RFI Generation
Machine Insertable, Wave Solderable
Clare and IXYS have combined to bring OptoMOS®
technology, reliability, and compact size to a new
family of high-power Solid State Relays.
As part of this family, the CPC1909 single pole
normally open (1-Form-A) Solid State Power Relay is
rated for up to 15A
rms continuous load current with a
5ºC/W heat sink.
The CPC1909 employs optically coupled MOSFET
technology to provide 2500V
rms of input to output
isolation. The output is constructed with efficient
MOSFET switches and photovoltaic die that use
Clare’s patented OptoMOS architecture while the
input, a highly efficient GaAlAs infrared LED provides
the optically coupled control. The combination of
low on-resistance and high load current handling
capability makes this relay suitable for a variety of high
performance switching applications.
The unique ISOPLUS-264 package pioneered
by IXYS allows Solid State Relays to achieve the
highest load current and power ratings. This package
features a unique IXYS process where the silicon
chips are soft soldered onto the Direct Copper
Bond (DCB) substrate instead of the traditional
copper leadframe. The DCB ceramic, the same
substrate used in high power modules, not only
provides 2500V
rms isolation but also very low thermal
resistance (0.3 °C/W).
Switching Characteristics of
Normally Open (Form A) Devices
CONTROL
I
LOAD
10%
90%
TON
TOFF
+
+
Approvals
UL recognized component: File # E69938
Certified to: UL 508


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