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CPC1909J Datasheet(PDF) 1 Page - Clare, Inc. |
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CPC1909J Datasheet(HTML) 1 Page - Clare, Inc. |
1 / 6 page www.clare.com DS-CPC1909-R03 1 CPC1909 ISOPLUS™-264 Power Relay e3 RoHS 2002/95/EC Part Number Description CPC1909J ISOPLUS-264 (25 per tube) Parameter Rating Units Blocking Voltage 60 V P Load Current, T A=25ºC With 5°C/W Heat Sink 15 A rms No Heat Sink 6.5 On-resistance 0.1 Ω RθJC 0.3 ºC/W Applications Features Description Ordering Information Pin Configuration • Industrial Controls • Motor Control • Robotics • Medical Equipment—Patient/Equipment Isolation • Instrumentation • Multiplexers • Data Acquisition • Electronic Switching • I/O Subsystems • Meters (Watt-Hour, Water, Gas) • Transportation Equipment • Aerospace/Defense • Compact ISOPLUS-264 Power Package • Low Thermal Resistance (0.3 °C/W) • 15A rms Load Current with 5°C/W Heat Sink • Electrically Non-conductive Thermal Pad for Heat Sink Applications • Low Drive Power Requirements • Arc-Free With No Snubbing Circuits • 2500V rms Input/Output Isolation • No EMI/RFI Generation • Machine Insertable, Wave Solderable Clare and IXYS have combined to bring OptoMOS® technology, reliability, and compact size to a new family of high-power Solid State Relays. As part of this family, the CPC1909 single pole normally open (1-Form-A) Solid State Power Relay is rated for up to 15A rms continuous load current with a 5ºC/W heat sink. The CPC1909 employs optically coupled MOSFET technology to provide 2500V rms of input to output isolation. The output is constructed with efficient MOSFET switches and photovoltaic die that use Clare’s patented OptoMOS architecture while the input, a highly efficient GaAlAs infrared LED provides the optically coupled control. The combination of low on-resistance and high load current handling capability makes this relay suitable for a variety of high performance switching applications. The unique ISOPLUS-264 package pioneered by IXYS allows Solid State Relays to achieve the highest load current and power ratings. This package features a unique IXYS process where the silicon chips are soft soldered onto the Direct Copper Bond (DCB) substrate instead of the traditional copper leadframe. The DCB ceramic, the same substrate used in high power modules, not only provides 2500V rms isolation but also very low thermal resistance (0.3 °C/W). Switching Characteristics of Normally Open (Form A) Devices CONTROL I LOAD 10% 90% TON TOFF + + Approvals • UL recognized component: File # E69938 • Certified to: UL 508 |
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