MSM8128 - 70/85/10/12

Issue 4.5 : April 2001

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Military Screening Procedure

Component Screening Flow for high reliability product is in accordance with Mil-883 method 5004

Visual and Mechanical

Internal visual

2010 Condition B or manufacturers equivalent

100%

Temperature cycle

100%

Constant acceleration

2001 Condition E (Y, only) (30,000g)

100%

Pre-Burn-in electrical

Per applicable device specifications at T

100%

Burn-in

Method 1015,Condition D,T

100%

Final Electrical Tests

Per applicable Device Specification

Static (dc)

a) @ T

100%

b) @ temperature and power supply extremes

100%

Functional

a) @ T

100%

b) @ temperature and power supply extremes

100%

Switching (ac)

a) @ T

100%

b) @ temperature and power supply extremes

100%

Percent Defective allowable (PDA)

Calculated at post-burn-in at T

5%

Hermeticity

1014

Fine

Condition A

100%

Gross

Condition C

100%

External Visual

2009 Per vendor or customer specification

100%

SCREEN

TEST METHOD

LEVEL

MB COMPONENT SCREENING FLOW

Alternate Pin Definition

NC

A5

A4

A6

A3

A7

A12

A14

A16

A2

A1

A0

GND

D2

D1

D0

VCC

A9

A11

A8

OE

A13

WE

NC

A15

A10

CS

D7

D3

D4

D5

D6

32

26

25

27

24

28

29

30

31

23

22

21

17

18

19

20

1

7

8

6

9

5

4

3

2

10

11

12

16

15

14

13

TOP VIEW

VX,SX