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IXDD404 Datasheet(PDF) 2 Page - IXYS Corporation |
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IXDD404 Datasheet(HTML) 2 Page - IXYS Corporation |
2 / 12 page 2 IXDD404 Unless otherwise noted, T A = 25 o C, 4.5V ≤ V CC ≤ 35V . All voltage measurements with respect to GND. IXDD404 configured as described in Test Conditions. All specifications are for one channel. Electrical Characteristics Symbol Parameter Test Conditions Min Typ Max Units VIH High input voltage 4.5V ≤ VIN ≤ 18V 2.5 V VIL Low input voltage 4.5V ≤ VIN ≤ 18V 0.8 V VIN Input voltage range -5 VCC + 0.3 V IIN Input current 0V ≤ VIN ≤ VCC -10 10 µA VOH High output voltage VCC - 0.025 V VOL Low output voltage 0.025 V ROH Output resistance @ Output high VCC = 18V 2 2.5 Ω ROL Output resistance @ Output Low VCC = 18V 1.5 2 Ω IPEAK Peak output current VCC = 18V 4 A IDC Continuous output current 1 A VEN Enable voltage range - 0.3 Vcc + 0.3 V VENH High En Input Voltage 2/3 Vcc V VENL Low En Input Voltage 1/3 Vcc V tR Rise time CL=1800pF Vcc=18V 16 18 ns tF Fall time CL=1800pF Vcc=18V 13 17 ns tONDLY On-time propagation delay CL=1800pF Vcc=18V 36 40 ns tOFFDLY Off-time propagation delay CL=1800pF Vcc=18V 35 39 ns tENOH Enable to output high delay time 30 ns tDOLD Disable to output low Disable delay time 30 ns VCC Power supply voltage 4.5 18 35 V ICC Power supply current VIN = 3.5V VIN = 0V VIN = + VCC 1 0 3 10 10 mA µA µA REN Enable Pull-up Resistor 200 k Ω Absolute Maximum Ratings (Note 1) Parameter Value Supply Voltage 40 V All Other Pins -0.3 V to VCC + 0.3 V Junction Temperature 150 oC Storage Temperature -65 oC to 150 oC Lead Temperature (10 sec) 300 oC Operating Ratings Parameter Value Operating Temperature Range -55 oC to 125 oC Thermal Impedance (Junction to Ambient) 8 Pin PDIP (PI) ( θJA) 120 oC/W 8 Pin SOIC (SIA) ( θJA) 110 oC/W 8 Pin SOIC (SI) ( θJA) with heat sink** Heat sink area of 1cm 2 71 oC/W 16 Pin SOIC (SIA-16) (θJA) 110 oC/W Note 1: Operating the device beyond parameters with listed “absolute maximum ratings” may cause permanent damage to the device. Typical values indicate conditions for which the device is intended to be functional, but do not guarantee specific performance limits. The guaranteed specifications apply only for the test conditions listed. Exposure to absolute maximum rated conditions for extended periods may affect device reliability. Specifications to change without notice **Heat sink area is 1 oz. copper on one side of .06" thick FR4 soldered to metal back plane. |
Similar Part No. - IXDD404_07 |
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Similar Description - IXDD404_07 |
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