2

IXDD404

Unless otherwise noted, T

o

C, 4.5V

≤ V

All voltage measurements with respect to GND. IXDD404 configured as described in Test Conditions. All specifications are for one channel.

Electrical Characteristics

Symbol

Parameter

Test Conditions

Min

Typ

Max

Units

High input voltage

4.5V

2.5

V

Low input voltage

4.5V

0.8

V

Input voltage range

-5

V

Input current

0V

-10

10

µA

High output voltage

V

Low output voltage

0.025

V

Output resistance

@ Output high

2

2.5

Ω

Output resistance

@ Output Low

1.5

2

Ω

Peak output current

4

A

Continuous output

current

1

A

Enable voltage range

- 0.3

Vcc + 0.3

V

High En Input Voltage

2/3 Vcc

V

Low En Input Voltage

1/3 Vcc

V

Rise time

16

18

ns

Fall time

13

17

ns

On-time propagation

delay

36

40

ns

Off-time propagation

delay

35

39

ns

Enable to output high

delay time

30

ns

Disable to output low

Disable delay time

30

ns

Power supply voltage

4.5

18

35

V

Power supply current

1

0

3

10

10

mA

µA

µA

Enable Pull-up Resistor

200

k

Ω

Parameter

Value

Supply Voltage

40 V

All Other Pins

-0.3 V to VCC + 0.3 V

Junction Temperature

150 oC

Storage Temperature

-65 oC to 150 oC

Lead Temperature (10 sec)

300 oC

Operating Ratings

Parameter

Value

Operating Temperature Range

-55 oC to 125 oC

Thermal Impedance (Junction to Ambient)

8 Pin PDIP (PI) (

120 oC/W

8 Pin SOIC (SIA) (

110 oC/W

8 Pin SOIC (SI) (

Heat sink area of 1cm

2

71 oC/W

110 oC/W

Note 1: Operating the device beyond parameters with listed “absolute maximum ratings” may cause permanent

damage to the device. Typical values indicate conditions for which the device is intended to be functional, but do not

guarantee specific performance limits. The guaranteed specifications apply only for the test conditions listed.

Exposure to absolute maximum rated conditions for extended periods may affect device reliability.

Specifications to change without notice

**Heat sink area is 1 oz. copper on one side of .06" thick

FR4 soldered to metal back plane.