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TORX177PL Datasheet(PDF) 4 Page - Toshiba Semiconductor |
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TORX177PL Datasheet(HTML) 4 Page - Toshiba Semiconductor |
4 / 5 page TORX177PL(F,T) 2006-12-28 4 (6) Attaching the fiber optic receiving module Solder the fixed pins (pins 4 and 5) of the fiber optic receiving module TORX177PL(F,T) to the printed circuit board in order to fix it to the board. (7) Solvent When using solvent for flux removal, do not use a high acid or high alkali solvent. Be careful not to pour solvent in to the optical connector ports. If solvent is inadvertently poured in to them, clean it off using cotton tips. (8) Supply voltage Use the supply voltage within the recommended operating condition (VCC = 5 ± 0.25 V). Make sure that supply voltage does not exceed the maximum rating value of 6 V, even for an instant. (9) Interface The TORX177PL(F,T) has a TTL interface. It can be interfaced with any TTL−compatible C−MOS IC. (10) Output If the receiver output is at low and is connected to the power supply, or if the output is high and is connected to GND, the internal IC may be destroyed. (11) Soldering condition Solder at 260°C or less for no more than ten seconds. (12) Case(receptacle) material The case is made of polycarbonate. Polycarbonate is usually stable with acid, alcohol, and aliphatic hydrocarbons however, with petrochemicals (such as benzene, toluene, and acetone), alkali, aromatic hydrocarbons, or chloric hydrocarbons, polycarbonate becomes cracked, swollen, or melted. Please take care when choosing a packaging material by referencing the table below. 〈 Chemicals to avoid with polycarbonate〉 PHENOMENON CHEMICALS A Little deterioration But staining ・ nitric acid(low concentration) , hydrogen peroxide, chlorine B Cracked crazed, or Swollen ・ acetic acid(70% or more) ・ gasoline ・ methyl isobutyl ketone, ethyl acetate, butyl acetate ・ methyl methacrylate, ethyl ether, MEK ・ acetone, m-amino alcohol, carbon tetrachloride ・ carbon disulfide, trichloroethylene, cresol ・ thinners, oil of turpentine ・ triethanolamine C Melted { } : used as solvent ・ concentrated sulfuric acid ・ benzene ・ styrene, acrylonitrile, vinyl acetate ・ ethylenediamine, diethylenediamine ・ {chloroform, methyl chloride, tetrachloromethane, dioxane} {1,2-dichloroethane} D Decomposed ・ ammonia water ・ other alkali (13) Precautions when disposing of devices and packing materials. When disposing devices and packing materials, follow the procedures stipulated by local regulations in order to protect the environment against contamination. (14) Precautions during use Toshiba is continually working to improve the quality and the reliability of their products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and their vulnerability to physical stress. It is the responsibility of the buyer, when utilizing Toshiba products, to observe standards of safety, and to avoid situations in which the malfunction or failure of a Toshiba product could cause loss of human life, bodily injury or damage to property. When developing equipment, please ensure that Toshiba products are used within the specified operating ranges set forth in the most recent product specifications. Also, please keep in mind the precautions and conditions set forth in the Toshiba Semiconductor Reliability Handbook. |
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