BUF01900

BUF01901

SBOS337A − OCTOBER 2006 − REVISED OCTOBER 2006

www.ti.com

2

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate

precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

+20V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

+6V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Signal Input Terminals,

BIAS:

Voltage

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

SCL, SDA, A0, A1:

Voltage

−0.5V to +6V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Current

±10mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Continuous

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Operating Temperature

−40

°C to +95°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Storage Temperature

−65

°C to +150°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Junction Temperature

+125

°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

ESD Rating:

Human Body Model (HBM)

2000V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Charged-Device Model (CDM)

500V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade

device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is

not supported.

(2) Short-circuit to ground.

PRODUCT

PACKAGE-LEAD

PACKAGE DESIGNATOR

PACKAGE MARKING

BUF01900

DFN-10

DRC

BOO

BUF01900

TSSOP-8

PW

F01900

BUF01901

DFN-10

DRC

BOP

BUF01901

TSSOP-8

PW

F01901

(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site

at www.ti.com.

PIN CONFIGURATIONS

NC = No connection

V

S

V

COM

BIAS

GND

DGND

SDA

SCL

A0

A1

V

SD

1

2

3

4

5

10

9

8

7

6

Exposed

Thermal

Die Pad

on

Underside

DFN−10

BUF01900

V

S

NC

BIAS

GND

DGND

SDA

SCL

A0

A1

V

SD

1

2

3

4

5

10

9

8

7

6

Exposed

Thermal

Die Pad

on

Underside

DFN−10

BUF01901

V

S

V

COM

BIAS

GND

SDA

SCL

A0

V

SD

1

2

3

4

8

7

6

5

BUF01900

TSSOP−8

V

S

NC

BIAS

GND

SDA

SCL

A0

V

SD

1

2

3

4

8

7

6

5

BUF01901

TSSOP−8