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MP4211 Datasheet(PDF) 2 Page - Toshiba Semiconductor

Part # MP4211
Description  High Power, High Speed Switching Applications For Printer Head Pin Driver and Pulse Motor Driver For Solenoid Driver
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Manufacturer  TOSHIBA [Toshiba Semiconductor]
Direct Link  http://www.semicon.toshiba.co.jp/eng
Logo TOSHIBA - Toshiba Semiconductor

MP4211 Datasheet(HTML) 2 Page - Toshiba Semiconductor

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MP4211
2006-10-27
2
Array Configuration
Thermal Characteristics
Characteristics
Symbol
Max
Unit
Thermal resistance from channel to
ambient
(4-device operation, Ta = 25°C)
ΣRth (ch-a)
31.2
°C/W
Maximum lead temperature for
soldering purposes
(3.2 mm from case for t = 10 s)
TL
260
°C
Electrical Characteristics (Ta = 25°C)
Characteristics
Symbol
Test Condition
Min
Typ.
Max
Unit
Gate leakage current
IGSS
VGS = ±16 V, VDS = 0 V
±10
μA
Drain cut-off current
IDSS
VDS = −60 V, VGS = 0 V
−100
μA
Drain-source breakdown voltage
V (BR) DSS
ID = −10 mA, VGS = 0 V
−60
V
Gate threshold voltage
Vth
VDS = −10 V, ID = −1 mA
−0.8
−2.0
V
VGS = −4 V, ID = −2.5 A
0.24
0.28
Drain-source ON resistance
RDS (ON)
VGS = −10 V, ID = −2.5 A
0.16
0.19
Forward transfer admittance
|Yfs|
VDS = −10 V, ID = −2.5 A
2.0
4.0
S
Input capacitance
Ciss
630
pF
Reverse transfer capacitance
Crss
95
pF
Output capacitance
Coss
VDS = −10 V, VGS = 0 V, f = 1 MHz
290
pF
Rise time
tr
25
Turn-on time
ton
45
Fall time
tf
55
Switching time
Turn-off time
toff
VIN: tr, tf < 5 ns, duty ≤ 1%, tw = 10 μs
200
ns
Total gate charge
(Gate-source plus gate-drain)
Qg
22
nC
Gate-source charge
Qgs
16
nC
Gate-drain (“miller”) charge
Qgd
VDD ≈ −48 V, VGS = −10 V, ID = −5 A
6
nC
−10 V
0 V
VGS
VDD ≈ −30 V
ID = −2.5 A
VOUT
1
3
2
5
4
10
7
6
9
8


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