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ABSOLUTE MAXIMUM RATINGS

DISSIPATION RATING TABLE

TPS715xx

SLVS338O – MAY 2001 – REVISED JUNE 2007

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be

more susceptible to damage because very small parametric changes could cause the device not to meet its published

specifications.

PRODUCT

TPS715xxyyyz

XX is nominal output voltage (for example, 28 = 2.8 V, 285 = 2.85 V, 01 = Adjustable).

YYY is package designator.

Z is package quantity.

(1)

For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2)

Output voltages from 1.25 V to 5.4 V in 50 mV increments are available through the use of innovative factory EEPROM programming;

minimum order quantities may apply. Contact factory for details and availability.

UNIT

–0.3 V to +24 V

–0.3 V to +16.5 V

Peak output current

Internally limited

ESD rating, HBM

2 kV

ESD rating, CDM

500 V

Continuous total power dissipation

See Dissipation Rating Table

–40

°C to +150°C

–65

°C to +150°C

(1)

Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating

conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to network ground terminal.

DERATING FACTOR

BOARD

PACKAGE

POWER RATING

POWER RATING

POWER RATING

DCK

165

395

2.52 mW/

°C

250 mW

140 mW

100 mW

DCK

165

315

3.18 mW/

°C

320 mW

175 mW

130 mW

(1)

The JEDEC Low-K (1s) board design used to derive this data was a 3 inch

× 3 inch, two-layer board with 2 ounce copper traces on top

of the board.

(2)

The JEDEC High-K (2s2p) board design used to derive this data was a 3 inch

× 3 inch, multilayer board with 1 ounce internal power and

ground planes and 2 ounce copper traces on top and bottom of the board.

2

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