© 2004 Fairchild Semiconductor Corporation

www.fairchildsemi.com

FMS6408 Rev. 3.0.0

2

Part Number

Clamping

Mode

Peaking

Mode

(dB)

Level

(mV)

Level

(V)

Package

Packing

Method

FMS6408MTC144

YPbPr/YC

1.3

250

1.125

14-Lead, Thin Shrink Small Outline

Package (TSSOP)

94 Units Tube

FMS6408MTC145

YUV/RGB

0

250

250

14-Lead, Thin Shrink Small Outline

Package (TSSOP)

94 Units Tube

FMS6408MTC146

YUV/RGB

0.4

250

250

14-Lead, Thin Shrink Small Outline

Package (TSSOP)

94 Units Tube

FMS6408MTC147

YUV/RGB

0.9

250

250

14-Lead, Thin Shrink Small Outline

Package (TSSOP)

94 Units Tube

FMS6408MTC148

YUV/RGB

1.3

250

250

14-Lead, Thin Shrink Small Outline

Package (TSSOP)

94 Units Tube

FMS6408MTC149

YC/CV

0

250

1.125

14-Lead, Thin Shrink Small Outline

Package (TSSOP)

94 Units Tube

FMS6408MTC1410

YC/CV

0.4

250

1.125

14-Lead, Thin Shrink Small Outline

Package (TSSOP)

94 Units Tube

FMS6408MTC1411

YC/CV

0.9

250

1.125

14-Lead, Thin Shrink Small Outline

Package (TSSOP)

94 Units Tube

FMS6408MTC1412

YC/CV

1.3

250

1.125

14-Lead, Thin Shrink Small Outline

Package (TSSOP)

94 Units Tube

Notes

:

1.

All packages are Pb-free per JEDEC J-STD-020B standard.

2.

Factory programming options allow a single die to be configured for multiple operating modes.

Block Diagram

8MHz

*

Sync Processing

6d

B

gM

250mV

Y

OUT

6d

B

gM

6d

B

gM

250mV or

1.125V *

BYPASS (BYPASS/FILTER)

* Factory Selected Clamp

and Peaking Levels

250mV or

1.125V *

8MHz

*

8MHz

*

Figure 1. Block Diagram