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TB62802F Datasheet(PDF) 7 Page - Toshiba Semiconductor |
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TB62802F Datasheet(HTML) 7 Page - Toshiba Semiconductor |
7 / 19 page TB62802F 2006-06-13 7 Reference Characteristics Thermal Design The junction temperature is expressed as follows: Tj = Ta + (θjc + θca) × Pd = Ta + θja × Pd Tj: Junction temperature Ta: Ambient temperature θjc: Thermal resistance from chip to case (a specific value not affected by environment) θja: Thermal resistance from chip to ambient temperature (affected by environment) Pd: Power dissipation when driving external load Here, the thermal performance of the heat dispersion on the PCB and of the ambient temperature setting should be so designed that the calculated value is within the specified range. Load Capacitance vs. Power Dissipation Load capacitance pF 0 1.2 0 0.4 0.8 1 0.6 0.2 20 40 60 80 100 120 140 160 180 200 220 240 260 280 300 Drive frequency: 25 MHz (all bits are driven at the same frequency) Supply voltage: 5.0 V Light load capacitance: 20 pF Light load internal equivalent capacitance: 18 pF Heavy load internal equivalent capacitance: 57 pF Ambient temperature: 25°C Power Dissipation and Junction Temperature (reference value) Drive frequency MHz 0.00 1.0 3.0 5.0 7.0 9.0 11.0 13.0 15.0 17.0 19.0 21.0 23.0 25.0 0.10 0.20 0.30 0.40 0.50 0.60 0.70 0.80 0.90 1.00 120 0 60 20 40 80 100 Condition: (1) Power dissipation IC internal equivalent capacitance Heavy load = 57 pF Light load = 18 pF CCD input capacitance Main clock = 250 pF Control clock = 20 pF Driver supply voltage = 5.0 V Driver output amplitude = 5.0 V The main clock and control clock oscillate at the same frequency. (2) Junction temperature Ta = 25°C θja = 83.3°C/W (typical value for the IC itself) Power dissipation Junction temperature |
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