Copyright  ANPEC Electronics Corp.

Rev. B.5 - Jun, 2003

APL1085

www.anpec.com.tw

10

Table 2. Pb-free Process – Package Classification Reflow Tem peratures

Package Thickness

Volume mm

3

<350

Volume mm

3

350-2000

Volume mm

3

>2000

<1.6 m m

260 +0

°C*

260 +0

°C*

260 +0

°C*

1.6 m m – 2.5 m m

260 +0

°C*

250 +0

°C*

245 +0

°C*

≥2.5 mm

250 +0

°C*

245 +0

°C*

245 +0

°C*

*Tolerance: The device m anufacturer/supplier shall assure process com patibility up to and

including the stated classification tem perature (this m eans Peak reflow tem perature +0

°C.

For exam ple 260

°C+0°C) at the rated MSL level.

t

Ao

E

W

Po

P

Ko

Bo

D1

D

F

P1

Carrier Tape & Reel Dimension

Reliability Test Program

Test item

Method

Description

SOLDERABILITY

MIL-STD-883D-2003

245

°C, 5 SEC

HOLT

MIL-STD-883D-1005.7

1000 Hrs Bias @125

°C

PCT

JESD-22-B,A102

168 Hrs, 100

%RH, 121°C

TST

MIL-STD-883D-1011.9

-65

°C~150°C, 200 Cycles

ESD

MIL-STD-883D-3015.7

VHBM > 2KV, VMM > 200V

Latch-Up

JESD 78

Table 1. SnPb Entectic Process – Package Peak Reflow Tem peratures

Package Thickness

Volume mm

3

<350

Volume mm

3

≥≥≥≥350

<2.5 m m

240 +0/-5

°C

225 +0/-5

°C

≥2.5 m m

225 +0/-5

°C

225 +0/-5

°C

Classificatin Reflow Profiles(Cont.)