Data Sheet D14138EJ6V0DS

9

NP82N055EHE, NP82N055KHE, NP82N055CHE, NP82N055DHE, NP82N055MHE, NP82N055NHE

TAPE INFORMATION

There are two types (-E1, -E2) of taping depending on the direction of the device.

Reel side

Draw-out side

MARKING INFORMATION

82N055

Lot code

NEC

HE

Pb-free plating marking

Abbreviation of part number

RECOMMENDED SOLDERING CONDITIONS

These products should be soldered and mounted under the following recommended conditions.

For soldering methods and conditions other than those recommended below, please contact an NEC Electronics

sales representative.

For technical information, see the following website.

Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)

Soldering Method

Soldering Conditions

Recommended

Condition Symbol

Infrared reflow

MP-25ZJ, MP-25ZK

Maximum temperature (Package's surface temperature): 260

°C or below

Time at maximum temperature: 10 seconds or less

Time of temperature higher than 220

°C: 60 seconds or less

Preheating time at 160 to 180

°C: 60 to 120 seconds

Maximum number of reflow processes: 3 times

Maximum chlorine content of rosin flux (percentage mass): 0.2% or less

IR60-00-3

Wave soldering

MP-25, MP-25K, MP-25SK,

MP-25 Fin Cut

Maximum temperature (Solder temperature): 260

°C or below

Time: 10 seconds or less

Maximum chlorine content of rosin flux: 0.2% (wt.) or less

THDWS

Partial heating

MP-25ZJ, MP-25ZK,

MP-25K, MP-25SK

Maximum temperature (Pin temperature): 350

°C or below

Time (per side of the device): 3 seconds or less

Maximum chlorine content of rosin flux: 0.2% (wt.) or less

P350

Partial heating

MP-25, MP-25 Fin Cut

Maximum temperature (Pin temperature): 300

°C or below

Time (per side of the device): 3 seconds or less

Maximum chlorine content of rosin flux: 0.2% (wt.) or less

P300

Caution Do not use different soldering methods together (except for partial heating).

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