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TS39100CW Datasheet(PDF) 6 Page - Taiwan Semiconductor Company, Ltd |
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TS39100CW Datasheet(HTML) 6 Page - Taiwan Semiconductor Company, Ltd |
6 / 13 page TS39100/1/2/3/4/5 1A Ultra Low Dropout Voltage Regulator with Multi-Function 6/13 Version: B07 Application Information (Continue) Enable Input TS39101/2/3/4/5 versions feature an active-high enable (EN) input that allows ON/OFF control of the regulator. Current drain reduces to “zero” when the device is shutdown, with only micro-amperes of leakage current. The EN input has TTL/CMOS compatible thresholds for simple interfacing with logic interfacing. EN may be directly tied to ViN and pulled up to the maximum supply voltage. Error Flag TS39101/3 versions feature an Error Flag, which looks at the output voltage and signals an error condition when this voltage drops 5% below its expected value. The error flag is an open-collector output that pulls low under fault conditions. It may sink 10mA. Low output voltage signifies a number of possible problems, including an over-current fault (the device is in current limit) or low input voltage. The flag output is inoperative during over temperature shutdown conditions. A pull-up resistor from error flag to either ViN or VOUT is required for proper operation. For information regarding the minimum and maximum values of pull-up resistance, refer the graph as follow: Thermal Resistance Power SOP-8 Thermal Characteristic TS39101/2/4 series’ performance is its power SOP-8 package featuring half the thermal resistance of a standard SOP- 8 package. Lower thermal resistance means more output current or higher input voltage for a standard SOP-8 package. Lower thermal resistance means more output current or higher input voltage for a given package size. Lower thermal resistance is achieved by connect the four ground pins with the die attached pad to create a single piece electrical and thermal conductor. This concept have been used by MOSFET production for years, proving very reliable and cost effective for the user. As above thermal resistance figure. Thermal resistance consists of two main elements, ΘJC (junction to case) and ΘCA (case to ambient). Using the power SOP-8 reduces ΘCA, the total thermal resistance, ΘJA (junction to ambient) is the limiting factor in calculating the maximum power dissipation capability of the device. Typically, the power SOP-8 have a ΘJC of 20 oC/W dramatically , this is significantly lower than the standard SOP-8 which is typically 75 oC/W. ΘCA is reduced because pin 5~8 can be soldered directly to a ground plane which significantly reduces the case to sink and sink to ambient thermal resistance. |
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