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XC6120C102NR Datasheet(PDF) 7 Page - Torex Semiconductor |
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XC6120C102NR Datasheet(HTML) 7 Page - Torex Semiconductor |
7 / 13 page 7/13 XC6120 Series [Figure 1: Circuit connected with the input resistor] ● Oscillation Description [Figure 2: Oscillation caused by the input resistor of the CMOS output product and the output current] ■NOTE ON USE 1. Please use this IC within the stated maximum ratings. Operation beyond these limits may cause degrading or permanent damage to the device. 2. In order to stabilize the IC's operations, please ensure that VIN pin's input frequency's rise and fall times are more than several μs / V. 3. With a resistor connected between the VIN pin and the power supply VDD some errors may be observed from the input voltage at the detect and release voltage. Those errors are not constant because of the fluctuation of the supply current. 4. When a resistor is connected between the VIN pin and the power supply VDD, oscillation may occur as a result of through current and voltage drop at the RIN at the time of voltage release. (refer to the Oscillation Description (1) below ) Especially in the CMOS output configurations, oscillation may occur regardless of detect/release operation if load current (IOUT) exists. (refer to the Oscillation Description (2) below) 5. Please use N-ch open drains configuration, when a resistor RIN is connected between the VIN pin and the power supply VDD power source. In such cases, please ensure that RIN is less than 10kΩ and that C is more than 0.1μF. (1) Oscillation as a result of through current Since the XC6120 series are CMOS ICs, transient through current will flow when the IC's internal circuit switching operates regardless of output configuration. Consequently, oscillation is liable to occur as a result of the similar operations as in (1) above. This oscillation does not occur during the detect operation. (2) Output current oscillation with the CMOS output configuration As shown in figure 2, when the voltage applied at the power supply (VDD) rises from below detect voltage to above release voltage, the IC commence release operations and the internal P-ch driver transistor will be on. The output current (IOUT) flows the input resistor (RIN) via the P-ch driver transistor. Because of the input resistor (RIN) and the output current (IOUT), an input pin voltage drops RIN x IOUT. If the voltage drop level is larger than the IC’s hysteresis width (VHYS), the input pin voltage will falls below the VDF and detect operations will commerce so that the internal P-ch driver transistor will be off. The voltage drop will stop because the output current (IOUT) which was flowing the P-ch driver transistor will run down. The input pin voltage will become the same voltage level as the input voltage (VIN). For this, the input pin voltage will rise above the release voltage (VDR), therefore, the release operations will begin over again. Oscillation may occur with this repetition. Further, this condition will also appear via means of a similar mechanism during detect operations. XC6120N XC6120C |
Similar Part No. - XC6120C102NR |
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Similar Description - XC6120C102NR |
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