MLX90242
Linear Hall Effect Sensor
3901090242
Page 6 of 7
Data Sheet
Rev. 024
Mar/04
10.
ESD Precautions
Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).
Always observe Electro Static Discharge control procedures whenever handling semiconductor products.
11.
Package Information
42GA
2053
1
2
3
*
All Dimensions in millimeters
1.95 +/- 0.15
0.45
0.41
Marked
Surface
UA Hall Plate / Chip Location
1.60
1.40
45o
Typical
4.30
3.90
2.64
2.34
0.84
0.63
3.20
2.80
1.75
1.55
0.48
0.43
0.20
0.00
0.41
0.35
1.30
1.24
2.57
2.51
0.38
Typical
(see note 3)
15.0
14.0
0.41
0.35
UA Package Dimensions
* MARKING:
Line 1:
1st and 2nd digits (42) = Part Number MLX90242
3rd and 4th digits (GA) = Version number
Line 2:
1st digit (2)
= Year (2002)
2nd and 3rd digits(05)
= Week of Year
4th digit (3)
= Last Lotnumber Digit
PINOUT:
Pin 1
V
DD
Pin 2
GND (Vss)
Pin 3
Output
NOTES:
1.) Controlling dimension: mm
2.) Leads must be free of flash and
plating voids
3.) Leads must not arc toward
the rear of package
4.) Package dimensions exclude
molding flash
5.) Tolerance is 0.254mm unless
otherwise specified
Hall Plate dimension:
0.150x0.150
Max 5o
Max 5
o
Typ 5
o
0.7 Max
* MARKING:
1&2 Digits (42) = Part Number (90242)
3,4&5 Dgits(951) =Last Lotnumber Digits
42951
1.30
1.00
0.10
0.00
3.10
2.70
3.00
2.60
0.50
0.35
1.80
1.50
chip
0.66
0.56
0.20
MIN
0.25
0.10
2.10
1.70
0.90
0.70
*
SOT-23 Hall Plate / Chip Location
SOT-23 Package Dimensions
NOTES:
1.) Controlling dimension: mm
2.) Lead thickness after solder plating will
be 0.254 mm maximum
3.) Package dimensions exclude molding
flash
4.) The end flash shall not exceed 0.127 mm
on each side of package
5.) Tolerance is 0.254mm unless otherwise
specified
PINOUT:
Pin 1
V
DD
Pin 2
Outpout
Pin 3
GND
Bottom View of Package
0 +/- 0.15
MLX90242
1
2
3
2
3
1
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