MLX90316
Rotary Position Sensor IC
3901090316
Page 5 of 41
Data Sheet
Rev. 003
April 07
14.6.
PROGRAMMABLE DIAGNOSTIC SETTINGS .................................................................................................24
14.6.1.
RESONFAULT Parameter ...................................................................................................................24
14.6.2.
EEHAMHOLE Parameter ....................................................................................................................24
14.7.
LOCK.........................................................................................................................................................24
14.7.1.
MLXLOCK Parameter .........................................................................................................................24
14.7.2.
LOCK Parameter .................................................................................................................................24
15. MLX90316 SELF DIAGNOSTIC.......................................................................................................... 25
16. SERIAL PROTOCOL........................................................................................................................... 27
16.1.
INTRODUCTION .........................................................................................................................................27
16.2.
SERIAL PROTOCOL MODE ...................................................................................................................27
16.3.
MOSI (MASTER OUT SLAVE IN) ...............................................................................................................27
16.4.
MISO (MASTER IN SLAVE OUT) ...............................................................................................................27
16.5.
/SS (SLAVE SELECT) .................................................................................................................................27
16.6.
MASTER START-UP...................................................................................................................................27
16.7.
SLAVE START-UP......................................................................................................................................27
16.8.
TIMING......................................................................................................................................................28
16.9.
SLAVE RESET ............................................................................................................................................29
16.10.
FRAME LAYER ..........................................................................................................................................29
16.10.1.
Command Device Mechanism ..........................................................................................................29
16.10.2.
Data Frame Structure ......................................................................................................................29
16.10.3.
Timing ..............................................................................................................................................29
16.10.4.
Data Structure ..................................................................................................................................30
16.10.5.
Angle Calculation.............................................................................................................................30
16.10.6.
Error Handling.................................................................................................................................30
17. RECOMMENDED APPLICATION DIAGRAMS .................................................................................. 31
17.1.
ANALOG OUTPUT WIRING WITH THE MLX90316 IN SOIC PACKAGE.......................................................31
17.2.
ANALOG OUTPUT WIRING WITH THE MLX90316 IN TSSOP PACKAGE....................................................31
17.3.
PWM LOW SIDE OUTPUT WIRING ............................................................................................................32
17.4.
SERIAL PROTOCOL ....................................................................................................................................32
17.4.1.
SPI Version – Single Die ......................................................................................................................32
17.4.2.
SPI Version – Dual Die ........................................................................................................................33
17.4.3.
Non SPI Version (Standard Version)....................................................................................................34
18. STANDARD INFORMATION REGARDING MANUFACTURABILITY OF MELEXIS PRODUCTS
WITH DIFFERENT SOLDERING PROCESSES ........................................................................................ 35
19. ESD PRECAUTIONS........................................................................................................................... 35
20. PACKAGE INFORMATION................................................................................................................. 36
20.1.
SOIC8 - PACKAGE DIMENSIONS ...............................................................................................................36
20.2.
SOIC8 - PINOUT AND MARKING ...............................................................................................................36
20.3.
SOIC8 - IMC POSITIONNING.....................................................................................................................37
20.4.
TSSOP16 - PACKAGE DIMENSIONS...........................................................................................................38
20.5.
TSSOP16 - PINOUT AND MARKING ..........................................................................................................39
20.6.
TSSOP16 - IMC POSITIONNING................................................................................................................39
21. DISCLAIMER ....................................................................................................................................... 41
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