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KBP204 Datasheet(PDF) 1 Page - DAESAN ELECTRONIC CORP. |
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KBP204 Datasheet(HTML) 1 Page - DAESAN ELECTRONIC CORP. |
1 / 2 page KBP201 THRU KBP207 Features Mechanical Data · Glass Passivated Die Construction · High Case Dielectric Strength of 1500VRMS · Low Reverse Leakage Current · Surge Overload Rating to 65A Peak · Ideal for Printed Circuit Board Applications · Plastic Material - UL Flammability Classification 94V-0 Maximum Ratings And Electrical Characteristics · Case : Molded Plastic · Terminals : Plated Leads, Solderable per MIL-STD-202, Method 208 · Polarity : As Marked on Body · Approx. Weight : 1.52 grams · Mounting Position : Any · Marking : Type Number (Ratings at 25 ℃ ambient temperature unless otherwise specified, Single phase, half wave 60Hz, resistive or inductive load. For capacitive load, derate by 20%) CURRENT 2.0 Amperes VOLTAGE 50 to 1000 Volts Notes: (1) Thermal resistance from junction to case per element. Unit mounted on 75 x 75 x 16mm aluminum plate heat sink. (2) Measured at 1.0MHz and Applied Reverse Voltage of 4.0V DC. Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage RMS Reverse Voltage Average Rectified Output Current @ TC=105 Non-Repetitive Peak Forward Surge Current, 8.3ms single half-sine-wave superimposed on rated load per element (JEDEC method) Volts Forward Voltage (per element) @ IF=2.0 A VRMM VRWM VR 50 Volts Symbols Units 1.1 VFM VR(RMS) 2.0 Amps 65 IFSM Tj TSTG 500 -65 to +150 ℃ Amps Peak Reverse Current at Rated DC Blocking Voltage Typical Junction Capacitance per Element (Note 2) Operating and Storage Temperature Range KBP 201 KBP 202 KBP 203 KBP 204 KBP 205 KBP 206 KBP 207 35 5.0 25 100 70 200 140 400 280 600 420 800 560 1000 700 Volts μA ℃/W pF Io IRM Cj R θJC @ TC=25 ℃ @ TC=125 ℃ Typical Thermal Resistance (Note 1) 38 ℃ K B P Dim Min Max A 14.00 15.00 B 10.50 11.50 C 15.00 D 4.70 5.00 E 3.50 4.00 G 2.30 2.50 H 0.70 T ypical A ll Dimens ions in mm - + A B C E G H D |
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