8

8 - 25

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order On-line at www.hittite.com

Outline Drawing

Absolute Maximum Ratings

Gain Control

NOTES:

1. LEADFRAME MATERIAL: COPPER ALLOY

2. DIMENSIONS ARE IN INCHES [MILLIMETERS]

3. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE.

4. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE.

5. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND.

Drain Bias Voltage (Vdd)

+7.0 Vdc

Control Voltage Range (Vctl)

-0.2V to Vdd

RF Input Power (RFin)(Vdd = +3.0 Vdc)

-7 dBm

Channel Temperature

150 °C

Continuous Pdiss (T = 85 °C)

(derate 5.62 mW/°C above 85 °C)

0.365 W

Thermal Resistance

(channel to lead)

178 °C/W

Storage Temperature

-65 to +150 °C

Operating Temperature

-40 to +85 °C

Vctl (Vdc)

Gain State

Typical

Ictl (uA)

0.0

Maximum

25

1.5

Middle

25

Vdd

Minimum

25

GaAs MMIC LOW NOISE AMPLIFIER

with AGC, 2.3 - 2.5 GHz

v02.0605

Part Number

Package Body Material

Lead Finish

MSL Rating

Package Marking

[3]

HMC287MS8

Low Stress Injection Molded Plastic

Sn/Pb Solder

MSL1

[1]

H287

XXXX

HMC287MS8E

RoHS-compliant Low Stress Injection Molded Plastic

100% matte Sn

MSL1

[2]

H287

XXXX

[1] Max peak reflow temperature of 235 °C

[2] Max peak reflow temperature of 260 °C

[3] 4-Digit lot number XXXX

Package Information