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HMC322 Datasheet(PDF) 4 Page - Hittite Microwave Corporation |
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HMC322 Datasheet(HTML) 4 Page - Hittite Microwave Corporation |
4 / 6 page 4 4 - 17 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com Outline Drawing NOTES: 1. DIMENSIONS IN INCHES [MILLIMETERS]. 2. DIE THICKNESS IS 0.004”. 3. TYPICAL BOND PAD IS 0.004” SQUARE. 4. TYPICAL BOND PAD SPACING IS 0.006” CENTER TO CENTER. 5. BOND PAD METALLIZATION: GOLD. 6. BACKSIDE METALLIZATION: GOLD. 7. BACKSIDE METAL IS GROUND. 8. NO CONNECTION REQUIRED FOR UNLABELED GROUND BOND PADS. Die Packaging Information [1] Standard Alternate WP-3 [2] [1] Refer to the “Packaging Information” section for die packaging dimensions. [2] For alternate packaging information contact Hittite Microwave Corporation. HMC322 GaAs MMIC SP8T NON-REFLECTIVE SWITCH, DC - 10.0 GHz v00.0303 |
Similar Part No. - HMC322_06 |
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Similar Description - HMC322_06 |
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