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OPA211 Datasheet(PDF) 2 Page - Texas Instruments |
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OPA211 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 17 page www.ti.com ABSOLUTE MAXIMUM RATINGS (1) OPA211 OPA2211 SBOS377D – OCTOBER 2006 – REVISED FEBRUARY 2008 This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. Over operating free-air temperature range (unless otherwise noted). VALUE UNIT Supply Voltage VS = (V+) – (V–) 40 V Input Voltage (V–) – 0.5 to (V+) + 0.5 V Input Current (Any pin except power-supply pins) ±10 mA Output Short-Circuit(2) Continuous Operating Temperature (TA) –55 to +150 °C Storage Temperature (TA) –65 to +150 °C Junction Temperature (TJ) 200 °C Human Body Model (HBM) 3000 V ESD Ratings Charged Device Model (CDM) 1000 V (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those specified is not supported. (2) Short-circuit to VS/2 (ground in symmetrical dual supply setups), one amplifier per package. PACKAGE/ORDERING INFORMATION(1) PACKAGE PACKAGE PRODUCT PACKAGE-LEAD SINGLE SHUTDOWN DUAL DESIGNATOR MARKING Standard Grade DFN-8 (3 ×3mm)(2) ü ü DRG OBDQ OPA211AI MSOP-8(2) ü ü DGK OBCQ A TI OPA OPA211AI SO-8 ü D 211 DFN-8 (3 ×3mm)(3) ü DRG OBHQ OPA2211AI A TI OPA SO-8 PowerPAD(3) ü DDA 2211 High Grade(3) DFN-8 (3 ×3mm) ü ü DRG OBDQ MSOP-8 ü ü DGK OBCQ OPA211I TI OPA SO-8 ü D 211 DFN-8 (3 ×3mm) ü DRG OBHQ OPA2211I TI OPA SO-8 PowerPAD ü DDA 2211 (1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. (2) Available Q2, 2008. (3) Available Q3, 2008. 2 Submit Documentation Feedback Copyright © 2006–2008, Texas Instruments Incorporated Product Folder Link(s): OPA211 OPA2211 |
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